US2005277743A1PendingUtilityA1

Curable resin composition and its use

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Assignee: NOZAKI MITSURUPriority: Jun 9, 2004Filed: Jun 3, 2005Published: Dec 15, 2005
Est. expiryJun 9, 2024(expired)· nominal 20-yr term from priority
Inventors:Mitsuru Nozaki
C08G 73/12B32B 27/04C08G 73/0655H05K 1/0346B32B 2307/51B32B 2363/00B32B 2311/12C08L 35/00B32B 2262/0261B32B 27/281B32B 2262/0269B32B 7/12B32B 27/38B32B 2311/00B32B 2379/08B32B 2333/04B32B 27/36B32B 2457/08B32B 2307/306B32B 2262/101B32B 27/26B32B 15/043
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Claims

Abstract

A resin composition improved in resistance to crack and having elasticity and high heat resistance, which composition contains a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the following formula (1), a copper-clad laminate using the above resin composition and a printed wiring board using the above copper-clad laminate, wherein n is an average value and is in the range of from 1 to 30.

Claims

exact text as granted — not AI-modified
1 . A resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the formula (1),  
     
       
         
         
             
             
         
       
       wherein n is an average value and is in the range of from 1 to 30.  
     
   
   
       2 . A resin composition according to  claim 1 , wherein the amount of the bismaleimide compound (b) per 100 parts by weight of the cyanate ester resin (a) is 5 to 200 parts by weight.  
   
   
       3 . A resin composition according to  claim 1 , which further contains an epoxy resin.  
   
   
       4 . A resin composition according to  claim 1 , which further contains a curing catalyst or a curing accelerator.  
   
   
       5 . A copper-clad laminate using the resin composition recited in  claim 1 .  
   
   
       6 . A printed wiring board using the copper-clad laminate recited in  claim 5.

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