Assignee
NOZAKI MITSURU
JP·0 granted patents·4 pending applications·0 citations·filing 2005–2010
Top patents by PatentIndex Score
4 records- 0150US2006093824A1Resin composition and its useNOZAKI MITSURU·Filed 2005·Application pending·0 cites
- 0249US2012189859A1Resin composite electrolytic copper foil, copper clad laminate and printed wiring boardNOZAKI MITSURU·Filed 2010·Application pending·0 cites
- 0345US2011281126A1Resin composite copper foilNOZAKI MITSURU·Filed 2009·Application pending·0 cites
- 0444US2005277743A1Curable resin composition and its useNOZAKI MITSURU·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when NOZAKI MITSURU files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →