Ready-for-dispatch package for semiconductor wafers, and method for the ready-for-dispatch packaging of semiconductor wafers

Abstract

The invention relates to a ready-for-dispatch package for semiconductor wafers, comprising a) a closeable plastic container which is loaded with the semiconductor wafers and has a lid and a body, a seal between the lid and the body and a particle filter which is integrated with the container and allows exchange of gas between the interior space of the container and the external environment of the container; b) a first sheath made from plastic, which surrounds the container and rests closely against the container with the aid of reduced pressure; c) a means for binding moisture; d) a second sheath made from coated plastic, with a coating which blocks the passage of moisture and rests closely against the first sheath and against the container with the aid of reduced pressure; e) a shock-absorbing structure which embeds the sheathed container in a positive-fitting manner; and f) an outer packaging which surrounds the double-sheathed and embedded container in a positive-fitting manner. The invention also relates to a method for the ready-for-dispatch packaging of semiconductor wafers in a packaging of this type.

1 . A ready-for-dispatch package for semiconductor wafers, comprising 
 a) a closeable plastic container which is loaded with semiconductor wafers and has a lid and a body, a seal between the lid and the body and a particle filter which is integrated with the container and allows the exchange of gas between the interior space of the container and the external environment of the container;    b) a first sheath of plastic, which surrounds the container and rests closely against the container through the aid of reduced pressure;    c) a moisture absorber;    d) at least a second sheath made from coated plastic, which rests closely against the first sheath and against the container with the aid of reduced pressure, at least one coating being a coating which blocks the passage of moisture;    e) a shock-absorbing structure which embeds the sheathed container in a positive-fitting manner; and    f) an outer package which surrounds the double-sheathed and embedded container in a positive-fitting manner.    
   
   
       2 . The package of  claim 1 , wherein the first sheath is transparent.  
   
   
       3 . The package of  claim 1 , wherein the second sheath has a tear-resistant outer coating.  
   
   
       4 . The package of  claim 1 , wherein the reduced pressure between the first sheath and the second sheath and the outside environment of the second sheath is up to 50 mbar.  
   
   
       5 . A method for the ready-for-dispatch packaging of semiconductor wafers in the package of  claim 1 , comprising: 
 a) cleaning and drying a plurality of containers, the plurality of containers constituting a batch;    b) analyzing one container of the batch for the presence of impurities caused by particles, metals and organic substances and defining a limit value for each;    c) loading the other containers of the batch with semiconductor wafers and closing the container lids, provided that the analyses have shown that the respective impurities are below the defined limit values;    d) sheathing individual containers with a first sheath and creating a reduced pressure inside the first sheath until the first sheath rests closely against the container;    e) sheathing the individual sheathed containers with a second sheath, and creating a reduced pressure inside the second sheath, until the second sheath rests closely against the sheathed container;    f) introducing a moisture absorber between the container and the first sheath during step d) or between the sheathed containers and the second sheath during step e), or between both the containers and the first sheath and the first sheath and the second sheath;    g) embedding double-sheathed container(s) in a shock-absorbing structure; and    h) packing the at least double-sheathed and embedded container(s) into the outer package and closing the outer package.    
   
   
       6 . The method as claimed in  claim 5 , wherein the following limit values are defined for the analyses carried out in step b): 
 a) in a liquid particle count test:    particles with a diameter of >1 μm, fewer than 50 particles;    for particles with a diameter of >0.3 μm, fewer than 1,000 particles;    for particles with a diameter of >0.2 μm, fewer than 2,000 particles;    b) for traces of metals and metal ions by    ICP-MS, a total weight of metals of at most 100 ng;    by CE, a total weight of ions of at most 200 ng;    c) for organic impurities    by gas chromatography, a total concentration of organic impurities of <50 ppm, based on the weight of the container material tested.    
   
   
       7 . The method of  claim 5 , further comprising i) selecting containers which constitute a batch which has failed the analyses of step b), and repeating steps a) through h) and optionally i).