Assignee
SILTRONIC AG
DE·210 granted patents·79 pending applications·674 citations·filing 1999–2025
Top patents by PatentIndex Score
289 records- 0193US11380621B2Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2018·Granted Jul 5, 2022·10 cites·10 claims
- 0293US7655089B2Process and apparatus for producing a single crystal of semiconductor materialSILTRONIC AG·Filed 2008·Granted Feb 2, 2010·9 cites·13 claims
- 0390US8376811B2Method for the double sided polishing of a semiconductor waferSILTRONIC AG·Filed 2010·Granted Feb 19, 2013·13 cites·19 claims
- 0489US9458554B2Semiconductor wafer composed of monocrystalline silicon and method for producing itSILTRONIC AG·Filed 2013·Granted Oct 4, 2016·13 cites·8 claims
- 0588US7964275B2Silicon wafer having good intrinsic getterability and method for its productionSILTRONIC AG·Filed 2007·Granted Jun 21, 2011·8 cites·16 claims
- 0688US7935614B2Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafersSILTRONIC AG·Filed 2009·Granted May 3, 2011·11 cites·15 claims
- 0788US7867059B2Semiconductor wafer, apparatus and process for producing the semiconductor waferSILTRONIC AG·Filed 2007·Granted Jan 11, 2011·21 cites·16 claims
- 0888US7828893B2Silicon wafer and process for the heat treatment of a silicon waferSILTRONIC AG·Filed 2006·Granted Nov 9, 2010·15 cites·15 claims
- 0987US7785706B2Semiconductor wafer and process for its productionSILTRONIC AG·Filed 2008·Granted Aug 31, 2010·14 cites·20 claims
- 1086US11869942B2Heteroepitaxial wafer and method for producing a heteroepitaxial waferSILTRONIC AG·Filed 2018·Granted Jan 9, 2024·8 cites·16 claims
- 1185US6899762B2Epitaxially coated semiconductor wafer and process for producing itSILTRONIC AG·Filed 2003·Granted May 31, 2005·42 cites·11 claims
- 1283US9333673B2Method for simultaneously cutting a multiplicity of wafers from a workpieceSILTRONIC AG·Filed 2014·Granted May 10, 2016·5 cites·14 claims
- 1383US7815489B2Method for the simultaneous double-side grinding of a plurality of semiconductor wafersSILTRONIC AG·Filed 2007·Granted Oct 19, 2010·15 cites·24 claims
- 1482US10283356B2Semiconductor wafer comprising a monocrystalline group-IIIA nitride layerSILTRONIC AG·Filed 2016·Granted May 7, 2019·5 cites·22 claims
- 1582US8382894B2Process for the preparation of silicon wafer with reduced slip and warpageSILTRONIC AG·Filed 2009·Granted Feb 26, 2013·8 cites·8 claims
- 1682US8372298B2Method for producing epitaxially coated silicon wafersSILTRONIC AG·Filed 2010·Granted Feb 12, 2013·9 cites·17 claims
- 1782US6997779B2Device for the simultaneous double-side grinding of a workpiece in wafer formSILTRONIC AG·Filed 2005·Granted Feb 14, 2006·11 cites·10 claims
- 1881US10991614B2Susceptor for holding a semiconductor wafer with an orientation notch during the deposition of a layer on a front side of the semiconductor wafer and method for depositing the layer by using the susceptorSILTRONIC AG·Filed 2018·Granted Apr 27, 2021·3 cites·3 claims
- 1981US9193026B2Method for polishing a semiconductor material waferSILTRONIC AG·Filed 2014·Granted Nov 24, 2015·4 cites·20 claims
- 2081US7793647B2Method and device for sawing a workpieceSILTRONIC AG·Filed 2007·Granted Sep 14, 2010·14 cites·11 claims
- 2180US8039361B2Multilayered semiconductor wafer and process for manufacturing the sameSILTRONIC AG·Filed 2007·Granted Oct 18, 2011·8 cites·17 claims
- 2280US7938911B2Process for cleaning a semiconductor wafer using a cleaning solutionSILTRONIC AG·Filed 2008·Granted May 10, 2011·8 cites·11 claims
- 2380US7838398B2Epitaxially coated semiconductor wafer and device and method for producing an epitaxially coated semiconductor waferSILTRONIC AG·Filed 2007·Granted Nov 23, 2010·6 cites·19 claims
- 2478US7341787B2Process for producing highly doped semiconductor wafers, and dislocation-free highly doped semiconductor wafersSILTRONIC AG·Filed 2005·Granted Mar 11, 2008·8 cites·8 claims
- 2578US6773333B2Method for cutting slices from a workpieceSILTRONIC AG·Filed 2002·Granted Aug 10, 2004·23 cites·8 claims
- 2677US12083705B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2019·Granted Sep 10, 2024·2 cites·11 claims
- 2777US10865499B2Susceptor for holding a semiconductor wafer, method for depositing an epitaxial layer on a front side of a semiconductor wafer, and semiconductor wafer with epitaxial layerSILTRONIC AG·Filed 2017·Granted Dec 15, 2020·3 cites·12 claims
- 2877US9340897B2Method for controlling the diameter of a single crystal to a set point diameterSILTRONIC AG·Filed 2014·Granted May 17, 2016·2 cites·11 claims
- 2977US8357939B2Silicon wafer and production method thereforSILTRONIC AG·Filed 2010·Granted Jan 22, 2013·4 cites·2 claims
- 3077US7579261B2Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafersSILTRONIC AG·Filed 2006·Granted Aug 25, 2009·5 cites·12 claims
- 3177US7052948B2Film or layer made of semi-conductive material and method for producing said film or layerSILTRONIC AG·Filed 2002·Granted May 30, 2006·23 cites·39 claims
- 3276US12479128B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2024·Granted Nov 25, 2025·0 cites·7 claims
- 3376US6861360B2Double-sided polishing process for producing a multiplicity of silicon semiconductor wafersSILTRONIC AG·Filed 2002·Granted Mar 1, 2005·20 cites·21 claims
- 3475US12308267B2Apparatus for transporting semiconductor wafersSILTRONIC AG·Filed 2022·Granted May 20, 2025·1 cites·10 claims
- 3575US7417297B2Film or layer of semiconducting material, and process for producing the film or layerSILTRONIC AG·Filed 2006·Granted Aug 26, 2008·6 cites·10 claims
- 3675US7394129B2SOI wafer and method for producing itSILTRONIC AG·Filed 2005·Granted Jul 1, 2008·5 cites·10 claims
- 3775US7387676B2Process for producing silicon semiconductor wafers with defined defect properties, and silicon semiconductor wafers having these defect propertiesSILTRONIC AG·Filed 2006·Granted Jun 17, 2008·5 cites·13 claims
- 3874US9011209B2Method and apparatus for trimming the working layers of a double-side grinding apparatusSILTRONIC AG·Filed 2014·Granted Apr 21, 2015·2 cites·2 claims
- 3974US8343618B2Silicon wafer and method of manufacturing the sameSILTRONIC AG·Filed 2009·Granted Jan 1, 2013·3 cites·3 claims
- 4074US7704126B2Method for producing a semiconductor wafer with profiled edgeSILTRONIC AG·Filed 2007·Granted Apr 27, 2010·6 cites·8 claims
- 4174US7470323B2Process for producing p-doped and epitaxially coated semiconductor wafers from siliconSILTRONIC AG·Filed 2007·Granted Dec 30, 2008·4 cites·20 claims
- 4274US7407891B2Method and apparatus for leveling a semiconductor wafer, and semiconductor wafer with improved flatnessSILTRONIC AG·Filed 2005·Granted Aug 5, 2008·5 cites·20 claims
- 4374US7077726B2Semiconductor wafer with improved local flatness, and method for its productionSILTRONIC AG·Filed 2002·Granted Jul 18, 2006·16 cites·3 claims
- 4473US11417733B2Semiconductor wafer of monocrystalline silicon and method of producing the semiconductor waferSILTRONIC AG·Filed 2018·Granted Aug 16, 2022·2 cites·4 claims
- 4573US11075070B2Monocrystalline semiconductor wafer and method for producing a semiconductor waferSILTRONIC AG·Filed 2016·Granted Jul 27, 2021·2 cites·18 claims
- 4673US9773688B2Ultrasonic cleaning method and ultrasonic cleaning apparatusSILTRONIC AG·Filed 2013·Granted Sep 26, 2017·3 cites·19 claims
- 4773US7108583B1Method for removing material from a semiconductor waferSILTRONIC AG·Filed 2006·Granted Sep 19, 2006·6 cites·20 claims
- 4873US6843848B2Semiconductor wafer made from silicon and method for producing the semiconductor waferSILTRONIC AG·Filed 2001·Granted Jan 18, 2005·13 cites·4 claims
- 4973US6793837B2Process for material-removing machining of both sides of semiconductor wafersSILTRONIC AG·Filed 2002·Granted Sep 21, 2004·18 cites·14 claims
- 5072US9174361B2Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpieceSILTRONIC AG·Filed 2013·Granted Nov 3, 2015·4 cites·17 claims
Showing the top 50 of 289 patent records by PatentIndex Score.
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