US2005157283A1PendingUtilityA1
Optical element with a self-assembled monolayer, lithographic projection apparatus including such an optical element, and device manufacturing method
Est. expiryJun 14, 2022(expired)· nominal 20-yr term from priority
G03F 1/24G03F 7/70958G03F 1/48B82Y 30/00G03F 7/20
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Claims
Abstract
A lithographic apparatus contains an optical element, the surface of the optical element being modified to reduce the effects of reflectivity reduction by molecular contamination. The surface includes a self assembled monolayer.
Claims
exact text as granted — not AI-modified1 . A lithographic projection apparatus, comprising:
a radiation system configured to provide a beam of EUV radiation; a support configured to support a patterning device, the patterning device configured to pattern the beam of radiation according to a desired pattern; a substrate table configured to hold a substrate; and a projection system configured to project the patterned beam onto a target portion of the substrate, wherein the radiation system and/or the projection system contains an optical element comprising
a substrate;
a Mo/Si multilayer stack on the substrate; and
a hydrophobic self-assembled monolayer on the multilayer stack.
2 . An apparatus according to claim 1 , wherein the optical element has a peak reflectivity for radiation having a wavelength of about 5 nm to about 50 nm.
3 . An apparatus according to claim 2 , wherein the reflectivity of the optical element is greater than about 40%.
4 . An apparatus according to claim 1 , wherein the optical element is a near-normal incidence mirror, a grazing incidence mirror, an integrator, or a sensor.
5 . An apparatus according to claim 4 , wherein the near-normal incidence mirror is a Mo/Si multilayer mirror.
6 . An apparatus according to claim 4 , wherein the integrator is a scattering plate.
7 . An apparatus according to claim 4 , wherein the sensor is an image sensor or a spot sensor.
8 . An apparatus according to claim 1 , wherein the self-assembled monolayer covers about 70% of a the multilayer stack.
9 . An optical element, comprising:
a substrate; a Mo/Si multilayer stack on the substrate; and a hydrophobic self-assembled monolayer on the multilayer stack.
10 . An optical element according to claim 9 , wherein the optical element has a peak reflectivity for radiation with a wavelength of about 5 nm to about 50 nm.
11 . An optical element according to claim 9 , wherein the reflectivity of the optical element is greater than about 40%.
12 . An optical element according to claim 9 , wherein the optical element is a near-normal incidence mirror, a grazing incidence mirror, an integrator, or a sensor.
13 . An optical element according to claim 12 , wherein the near-normal incidence mirror is a Mo/Si multilayer mirror.
14 . An optical element according to claim 12 , wherein the integrator is a scattering plate.
15 . An optical element according to claim 12 , wherein the sensor is an image sensor or a spot sensor.
16 . An optical element according to claim 9 , wherein the self-assembled monolayer covers about 70% of the multilayer stack.
17 . A device manufacturing method, comprising:
providing a beam of radiation; patterning the beam of radiation; and projecting the patterned beam of radiation onto a target portion of a substrate, wherein at least one optical element on which the beam of radiation is incident has, on its surface, a hydrophobic self-assembled monolayer.
18 . A method according to claim 17 , wherein the optical element has a peak reflectivity for radiation having a wavelength of about 5 nm to about 50 mm.
19 . A method according to claim 17 , wherein the reflectivity of the optical element is greater than about 40%.
20 . A method according to claim 17 , wherein the self-assembled monolayer covers about 70% of a surface of the optical element.Join the waitlist — get patent alerts
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