Packaging method for wafers

Abstract

A new and improved method for packaging substrates for shipping or transport. The method of the invention comprises a primary packaging structure in which the substrates are placed in a suitable substrate container; a secondary packaging structure in which the substrate container of the primary packaging structure is vacuum-sealed in an anti-static bag; a tertiary packaging structure in which the secondary packaging structure is fitted with a resilient cushion; and a quaternary or final packaging structure in which the tertiary packaging structure is sealed in a shipping carton.

What is claimed is:  
     
         1 . A wafer packing material for use in at least one type of front open shipping box container and preventing wafers from damage when dropped, comprising: 
 a first cushion section for engaging the container, at least one cushion foot having a cushion opening extending from a first surface of said first cushion section, and a depression area provided in a second surface of said first cushion section; and    a second cushion section for engaging the container, at least one cushion foot having a cushion opening extending from a first surface of said second cushion section, and a depression area provided in a second surface of said second cushion section for facing said depression area of said first cushion section when engaging the container.    
     
     
         2 . The wafer packing material of  claim 1  wherein said container comprises a front-opening shipping box.  
     
     
         3 . The wafer packing material of  claim 1  wherein said first cushion section and said second cushion section each comprises a plastic foam material.  
     
     
         4 . The wafer packing material of  claim 3  wherein said container comprises a front-opening shipping box.  
     
     
         5 . The wafer packing material of  claim 1  wherein said first cushion section comprises a first cushion panel and said at least one cushion foot of said first cushion section extends from said first cushion panel; and wherein said second cushion section comprises a second cushion panel and said at least one cushion foot of said second cushion section extends from said second cushion panel.  
     
     
         6 . The wafer packing material of  claim 5  wherein said container comprises a front-opening shipping box.  
     
     
         7 . The wafer packing material of  claim 5  wherein said first cushion section and said second cushion section each comprises a plastic foam material.  
     
     
         8 . The wafer packing material of  claim 7  wherein said container comprises a front-opening shipping box.  
     
     
         9 . The wafer packing material of  claim 5  further comprising a pair of cushion side walls and a pair of cushion end walls extending from each of said first cushion panel and said second cushion panel and at least one side extension extending from each of said pair of cushion side walls and at least one end extension extending from each of said pair of cushion end walls.  
     
     
         10 . The wafer packing material of  claim 9  wherein said container comprises a front-opening shipping box.  
     
     
         11 . The wafer packing material of  claim 9  wherein said first cushion section and said second cushion section each comprises a plastic foam material.  
     
     
         12 . The wafer packing material of  claim 11  wherein said container comprises a front-opening shipping box.  
     
     
         13 . A shipping and transport package for substrates, comprising: 
 a container for containing the substrates in a primary packaging structure;    an anti-static bag containing said primary packaging structure in a secondary packaging structure;    a pair of cushion sections fitted on said secondary packaging structure in a tertiary packaging structure, said pair of cushion sections each comprising at least one foot extending from a first surface, a depression area provided in a second surface for receiving said secondary packaging structure and a cushion opening provided in said at least one foot; and    a carton containing said tertiary packaging structure in a final packaging structure.    
     
     
         14 . The package of  claim 13  wherein said container comprises a front-opening shipping box.  
     
     
         15 . The package of  claim 13  wherein said pair of cushion sections each comprises a plastic foam material.  
     
     
         16 . The package of  claim 13  wherein said pair of cushion sections each comprises a cushion panel having said first surface and said second surface and a plurality of side extensions carried by said cushion panel for engaging said carton.  
     
     
         17 . The package of  claim 16  wherein said cushion panel further comprises a pair of cushion side walls and a pair of cushion end walls extending from said cushion panel and wherein said plurality of side extensions extends from each of said pair of cushion side walls.  
     
     
         18 . A method of forming a package for transporting substrates and testing said package for protection capability, comprising the steps of: 
 providing a container; an anti-static bag; a pair of cushion sections each having at least one foot extending from a first surface, a depression area provided in a second surface and a cushion opening provided in said at least one foot; and a carton;    placing the substrates in said container to define a primary packaging structure;    placing said primary packaging structure in said anti-static bag to define a secondary packaging structure;    placing said pair of cushion sections on said secondary packaging structure to define a tertiary packaging structure;    placing said tertiary packaging structure in said carton to define a final packaging structure; and    subjecting said final packaging structure to a free fall test, a vibration test and a transportation test.    
     
     
         19 . The method of  claim 18  wherein said free fall test comprises the steps of providing a strike surface and repeatedly positioning said final packaging structure about 150 cm above said strike surface and dropping said final packaging structure onto said strike surface.  
     
     
         20 . The method of  claim 18  wherein said vibration test comprises vibrating said final packaging structure along x, y and z axes for about an hour for each axis.