Vapor phase connection techniques

Abstract

Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

1 . A component for making connections in a microelectronic assembly comprising: 
 (a) a dielectric layer having first and second surfaces;    (b) a plurality of elongated conductors on said first surface; and    (c) slots in said dielectric layer extending through the layer beneath said conductors, said slots extending in the direction of elongation of said conductors.    
     
     
         2 . A component as claimed in  claim 1  further comprising a dispersible conductive material disposed in said slots.