Transfer assembly and apparatus for treating a substrate with the transfer assembly

Abstract

A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure and a vacuum atmosphere; a process chamber coupled to the vacuum transfer module and treating the substrate; and a ring carrier supported by the first transfer robot or the second transfer robot for a transfer of a ring member. The ring carrier comprises a plate having the ring member placed thereon and at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand.

What is claimed is: 
     
       1. A substrate treating apparatus comprising:
 an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; 
 a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; 
 a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure atmosphere and a vacuum atmosphere; 
 a process chamber coupled to the vacuum transfer module and treating the substrate; and 
 a ring carrier which can be supported by the first transfer robot or the second transfer robot for a transfer of a ring member provided at the process chamber and supporting the ring member, and 
 wherein the ring carrier comprises: 
 a plate having the ring member placed thereon; and 
 at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand, 
 wherein the load-lock chamber includes a plurality of support shelves supporting the substrate or the ring member in the inner space, 
 wherein a plurality of notches are formed through the plate at an edge region of the plate, and 
 the ring member supported by the ring carrier is seated on a support shelf when the first transfer robot or the second transfer robot is moved from a top side to a bottom side of the plurality of support shelves, and the plurality of notches are positioned to be aligned with the plurality of support shelves so the ring carrier moves together with the first transfer robot and the second transfer robot. 
 
     
     
       2. The substrate treating apparatus of  claim 1 , wherein the leg is provided as a pad. 
     
     
       3. The substrate treating apparatus of  claim 2 , wherein at least one substrate support pad for supporting a substrate is provided at a top surface of the first hand or the second hand, and
 wherein the pad is provided at a height at which the plate is upwardly spaced apart from the substrate support pad, when the ring carrier is placed on the first hand or the second hand. 
 
     
     
       4. The substrate treating apparatus of  claim 3 , wherein the pad and the substrate support pad are positioned to not interfere with each other seen from above when the first transfer robot or the second transfer robot transfers the ring member. 
     
     
       5. The substrate treating apparatus of  claim 4 , wherein the pad is a cylindrical shape. 
     
     
       6. The substrate treating apparatus of  claim 1 , wherein the leg is provided as a pin, and at least one substrate support pad for supporting a substrate is provided at a top surface of the first hand or the second hand, and a hole for inserting an end of the pin is further included. 
     
     
       7. The substrate treating apparatus of  claim 6 , wherein the pin is positioned at a height at which the plate is upwardly spaced apart from the substrate support pad, when the ring carrier is placed on the first hand or the second hand. 
     
     
       8. The substrate treating apparatus of  claim 7 , wherein the pin and the substrate support pad are positioned to not interfere with each other when seen from above when the first transfer robot or the second transfer robot transfers the ring member. 
     
     
       9. The substrate treating apparatus of  claim 8 , wherein the pin is provided in a cylindrical shape with a downwardly convex bottom surface. 
     
     
       10. The substrate treating apparatus of  claim 1 , wherein the plate is a circular plate form. 
     
     
       11. A transfer assembly comprising:
 a ring carrier supporting a ring member; and 
 a transfer robot having a transfer hand for selectively transferring a substrate and the ring carrier, and 
 wherein the ring carrier comprises: 
 a plate on which the ring member is placed; and 
 at least one leg protruding from a bottom surface of the plate, and placed on the transfer hand, 
 wherein the leg is provided as a pin, and 
 at least one substrate support pad for supporting the substrate is provided at a top surface of the transfer hand, and a hole for inserting an end of the pin is further included, and 
 wherein the pin is provided at a height at which the plate is upwardly spaced apart from the substrate support pad, when the ring carrier is placed on the transfer hand, and 
 the pin and the substrate support pad are positioned to not interfere with each other when seen from above when the transfer robot transfers the ring member. 
 
     
     
       12. The transfer assembly of  claim 11 , wherein the plate is a circular plate form. 
     
     
       13. A substrate treating apparatus comprising:
 a load port on which a container storing a substrate, a ring carrier, or a ring member is placed thereon; 
 an index chamber having an inside maintained at an atmospheric pressure atmosphere, and providing a transfer robot; 
 a load-lock chamber having an inside convertible between an atmospheric pressure and a vacuum pressure; and 
 a ring carrier used during a transfer of a ring member between the load port, the load-lock chamber, and the index chamber, and 
 wherein the transfer robot comprises: 
 a transfer hand selectively transferring a substrate and the ring carrier; and 
 at least one substrate support pad for supporting the substrate, and 
 wherein the load-lock chamber comprises a plurality of support shelves supporting the substrate or the ring member, and 
 wherein the ring carrier comprises: 
 a plate on which the ring member is placed; and 
 at least one leg protruding from a bottom surface of the plate, and placed on the transfer hand, and 
 wherein a plurality of notches are formed through the plate at an edge region of the plate, and the plurality of notches are positioned to overlap each of the plurality of support shelves when seen from above, and 
 wherein among the ring carrier and the ring member, the ring member is seated on a support shelf when the transfer robot transfers the ring member using the ring carrier, and 
 wherein the leg is positioned at a height at which the plate is upwardly spaced apart from the substrate support pad, when the ring carrier is placed on the transfer hand, and 
 wherein the leg and the substrate support pad are positioned to not interfere with each other when seen from above when the transfer robot transfers the ring member. 
 
     
     
       14. The substrate treating apparatus of  claim 13 , wherein the leg is provided as a pad. 
     
     
       15. The substrate treating apparatus of  claim 13 , wherein the leg is provided as a pin, and a hole for inserting an end of the pin is further included at a top surface of the transfer robot.