Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication

Abstract

The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

What is claimed is: 
     
       1. A vertical electrical interconnection system, comprising:
 a first semiconductor substrate having thereon a first electrical circuit; 
 a second semiconductor substrate at least partially vertically covering the first electrical circuit, and having thereon a second electrical circuit; 
 a ramp, formed by one of drilling or machining, passing through the second semiconductor substrate between first components of the first electrical circuit and second components of the second electrical circuit; and 
 a 3D printed conductive trace formed along the ramp to electrically connect the one of the first components and the one of the second components. 
 
     
     
       2. The system of  claim 1 , wherein the 3D printed conductive trace comprises a nanoparticle conductive ink. 
     
     
       3. The system of  claim 1 , wherein the second semiconductor substrate comprises a molded substrate molded about at least ones of the first components. 
     
     
       4. The system of  claim 1 , wherein the ramp is formed by one of laser drilling, laser micro machining, and C&C machining. 
     
     
       5. The system of  claim 1 , wherein the ramp comprises a triangular slice removed from the second semiconductor substrate. 
     
     
       6. The system of  claim 1 , wherein the first semiconductor substrate comprises a polycarbonate film. 
     
     
       7. The system of  claim 1 , wherein the second semiconductor substrate comprises a molded Acrylonitrile Butadiene Styrene (ABS). 
     
     
       8. The system of  claim 1 , wherein the ramp comprises an angle of between about 45° and about 70°. 
     
     
       9. The system of  claim 1 , wherein the ramp size comprises a range of about 800 microns to about 1000 microns. 
     
     
       10. The system of  claim 1 , wherein at least ones of the first components and the second components comprise surface mount technology (SMT) components. 
     
     
       11. The system of  claim 1 , wherein a thickness of the 3D printed conductive trace is greatest at a plane provided by an uppermost portion of the second semiconductor substrate. 
     
     
       12. The system of  claim 1 , wherein particle size of the 3D printed conductive trace is matched to a roughness of the ramp. 
     
     
       13. The system of  claim 1 , wherein the 3D printed conductive trace is rounded at a plane provided by an uppermost portion of the second semiconductor substrate. 
     
     
       14. The system of  claim 1 , wherein a thickness of the 3D printed conductive trace varies between about 10 and about 75 microns. 
     
     
       15. The system of  claim 1 , wherein the 3D printed conductive trace comprises a contact resistance in a range of about 0.10 and about 1.50 ohms/sq. 
     
     
       16. The system of  claim 1 , wherein the 3D printed conductive trace comprises a silver nanoparticle ink that contains about 60 weight/percent bulk silver.