Inventor · disambiguated record
Lim Lai Ming
Also filed as: MING LIM LAI
4 granted patents·1 pending application·0 citations·filing 2018–2024
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0181US2025308956A1Apparatus, system, and method of providing a ramped interconnect for semiconductor fabricationJABIL INC·Filed 2024·Application pending·0 cites
- 0279US12211713B2Apparatus, system, and method of providing a ramped interconnect for semiconductor fabricationJABIL INC·Filed 2023·Granted Jan 28, 2025·0 cites·16 claims
- 0369US11862492B2Apparatus, system, and method of providing a ramped interconnect for semiconductor fabricationJABIL INC·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 0466US11081375B2Apparatus, system, and method of providing a ramped interconnect for semiconductor fabricationJABIL INC·Filed 2020·Granted Aug 3, 2021·0 cites·16 claims
- 0548US10790172B2Apparatus, system, and method of providing a ramped interconnect for semiconductor fabricationMING LIM LAI·Filed 2018·Granted Sep 29, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →