Inventor · disambiguated record
Te-Hsuan Peng
Also filed as: PENG TE-HSUAN
3 granted patents·4 pending applications·0 citations·filing 2021–2024
45Inventor score
Files withWINBOND ELECTRONICS CORP7
Top patents by PatentIndex Score
7 records- 0170US12310000B2Manufacturing method of semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 0259US12016173B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·0 cites·14 claims
- 0359US11943913B2Method of manufacturing semiconductor structure having multi-work function gate electrodeWINBOND ELECTRONICS CORP·Filed 2023·Granted Mar 26, 2024·0 cites·15 claims
- 0453US2024321628A1Method for forming semiconductor structuresWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0552US2025125287A1Dynamic random-access memory devices and methods of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0651US2023084548A1Semiconductor structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 0750US2024334685A1Dynamic random access memory and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →