Inventor · disambiguated record
Takumi Kudou
Also filed as: KUDOU TAKUMI
1 granted patent·2 pending applications·11 citations·filing 2007–2015
32Inventor score
Files withKOTO ENGRAVING CO LTD3
Top patents by PatentIndex Score
3 records- 0179US10390437B2Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring circuit componentKOTO ENGRAVING CO LTD·Filed 2015·Granted Aug 20, 2019·11 cites·2 claims
- 0239US2008308220A1In-mold forming mold, in-mold forming apparatus, and in-mold forming methodKOTO ENGRAVING CO LTD·Filed 2007·Application pending·0 cites
- 0338US2007278715A1In-mold forming method, in-mold forming mold and in-mold forming apparatusKOTO ENGRAVING CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →