Assignee
KOTO ENGRAVING CO LTD
JP·2 granted patents·2 pending applications·11 citations·filing 2007–2018
Top patents by PatentIndex Score
4 records- 0179US10390437B2Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring circuit componentKOTO ENGRAVING CO LTD·Filed 2015·Granted Aug 20, 2019·11 cites·2 claims
- 0239US2008308220A1In-mold forming mold, in-mold forming apparatus, and in-mold forming methodKOTO ENGRAVING CO LTD·Filed 2007·Application pending·0 cites
- 0338US2007278715A1In-mold forming method, in-mold forming mold and in-mold forming apparatusKOTO ENGRAVING CO LTD·Filed 2007·Application pending·0 cites
- 0430US11040388B2Roll cutter deviceKOTO ENGRAVING CO LTD·Filed 2018·Granted Jun 22, 2021·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →