Inventor · disambiguated record
Shin Hung Hwang
Also filed as: HWANG SHIN HUNG
3 granted patents·2 pending applications·0 citations·filing 2017–2020
40Inventor score
Files withQDOS FLEXCIRCUITS SDN BHD5
Top patents by PatentIndex Score
5 records- 0137US2019006239A1Integrated circuit package having pin-up interconnectQDOS FLEXCIRCUITS SDN BHD·Filed 2018·Application pending·0 cites
- 0235US10049935B2Integrated circuit package having pin up interconnectQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Aug 14, 2018·0 cites·13 claims
- 0333US2021195734A1Integrated circuit substrate having a recess for receiving a solder filletQDOS FLEXCIRCUITS SDN BHD·Filed 2020·Application pending·0 cites
- 0422US10553475B2Single layer integrated circuit packageQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Feb 4, 2020·0 cites·1 claims
- 0522US10461004B2Integrated circuit substrate and method of producing thereofQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Oct 29, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →