Inventor · disambiguated record
Robert F. Preisser
Also filed as: PREISSER ROBERT F
0 granted patents·2 pending applications·0 citations·filing 2009–2010
Files withPREISSER ROBERT F2
Top patents by PatentIndex Score
2 records- 0130US2010206737A1Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)PREISSER ROBERT F·Filed 2009·Application pending·0 cites
- 028US2012024713A1Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolytePREISSER ROBERT F·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →