Inventor · disambiguated record
Robert Courtenay
Also filed as: COURTENAY ROBERT · COURTENAY ROBERT W · COURTENAY ROBERT WILLIAM
10 granted patents·4 pending applications·238 citations·filing 1988–2006
91Inventor score
Top patents by PatentIndex Score
14 records- 0191US5902399AMethod and apparatus for improved coating of a semiconductor waferMICRON TECHNOLOGY INC·Filed 1997·Granted May 11, 1999·65 cites·1 claims
- 0281US6107690ACoated semiconductor die/leadframe assembly and method for coating the assemblyMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·57 cites·3 claims
- 0377US4923294ALead frame holding deviceMICRON TECHNOLOGY INC·Filed 1988·Granted May 8, 1990·39 cites·11 claims
- 0476US6445060B1Coated semiconductor die/leadframe assembly and method for coating the assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 3, 2002·20 cites·24 claims
- 0562US5780923AModified bus bar with Kapton™ tape or insulative material on LOC packaged partMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 14, 1998·26 cites·37 claims
- 0657US6666917B2Apparatus for coating of a semiconductor waferMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 23, 2003·2 cites·1 claims
- 0755US6885087B2Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged partMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·5 cites·12 claims
- 0853US2006257561A1Method and apparatus for coating a waferMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0952US6423380B1Method of coating a semiconductor waferMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 23, 2002·12 cites·1 claims
- 1049US2006270117A1Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged partCOURTENAY ROBERT W·Filed 2006·Application pending·0 cites
- 1147US6580157B2Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged partMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·2 cites·39 claims
- 1247US2004052956A1Method and apparatus for coating a waferFiled 2003·Application pending·0 cites
- 1347US2005167793A1Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged partFiled 2005·Application pending·0 cites
- 1443US6255720B1Modified bus bar with Kapton tape or insulative material on LOC packaged partMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 3, 2001·10 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →