Inventor · disambiguated record
Mituo Ohdate
Also filed as: OHDATE MITUO
8 granted patents·85 citations·filing 1986–1992
86Inventor score
Files withMITSUBISHI ELECTRIC CORP8
Top patents by PatentIndex Score
8 records- 0173US4966549AWafer hanger useful for thermally treating semiconductor wafersMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 30, 1990·33 cites·12 claims
- 0259US4972988AMethod of soldering semiconductor substrate on supporting plateMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 27, 1990·26 cites·11 claims
- 0339US4829364ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1986·Granted May 9, 1989·10 cites·20 claims
- 0431US5109264ASemiconductor wafers having a shape suitable for thermal treatmentMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Apr 28, 1992·4 cites·3 claims
- 0531US4760037APressure contact type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Jul 26, 1988·5 cites·2 claims
- 0629USRE34696ESemiconductor device housing with electrodes in press contact with the opposite sides of chipMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 16, 1994·3 cites·6 claims
- 0728US5043301AMethod of thermally treating semiconductor wafers in furnace and wafer hanger useful thereinMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Aug 27, 1991·2 cites·3 claims
- 0828US4893173ALow-inductance semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jan 9, 1990·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →