Inventor · disambiguated record
Kenneth J. Kledzik
Also filed as: KLEDZIK KENNETH · KLEDZIK KENNETH J
16 granted patents·2 pending applications·965 citations·filing 1992–2010
95Inventor score
Files withLEGACY ELECTRONICS INC11MICRON TECHNOLOGY INC3KLEDZIK KENNETH J1MICRON ELECTRONICS INC1MICRON SEMICONDUCTOR INC1
Top patents by PatentIndex Score
18 records- 0197US5266912AInherently impedance matched multiple integrated circuit moduleMICRON TECHNOLOGY INC·Filed 1992·Granted Nov 30, 1993·266 cites·24 claims
- 0293US5400003AInherently impedance matched integrated circuit moduleMICRON TECHNOLOGY INC·Filed 1993·Granted Mar 21, 1995·135 cites·19 claims
- 0392US5612657AInherently impedance matched integrated circuit socketMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 18, 1997·104 cites·19 claims
- 0490US7405471B2Carrier-based electronic moduleLEGACY ELECTRONICS INC·Filed 2003·Granted Jul 29, 2008·62 cites·29 claims
- 0590US6545868B1Electronic module having canopy-type carriersLEGACY ELECTRONICS INC·Filed 2000·Granted Apr 8, 2003·69 cites·30 claims
- 0689US6713854B1Electronic circuit module with a carrier having a mounting pad arrayLEGACY ELECTRONICS INC·Filed 2000·Granted Mar 30, 2004·63 cites·34 claims
- 0787US6487078B2Electronic module having a three dimensional array of carrier-mounted integrated circuit packagesLEGACY ELECTRONICS INC·Filed 2000·Granted Nov 26, 2002·49 cites·47 claims
- 0884US7102892B2Modular integrated circuit chip carrierLEGACY ELECTRONICS INC·Filed 2003·Granted Sep 5, 2006·29 cites·90 claims
- 0984US6313998B1Circuit board assembly having a three dimensional array of integrated circuit packagesLEGACY ELECTRONICS INC·Filed 1999·Granted Nov 6, 2001·88 cites·34 claims
- 1081US7796400B2Modular integrated circuit chip carrierLEGACY ELECTRONICS INC·Filed 2006·Granted Sep 14, 2010·8 cites·18 claims
- 1181US5563838AModule having voltage control circuit to reduce surges in potentialMICRON ELECTRONICS INC·Filed 1995·Granted Oct 8, 1996·60 cites·25 claims
- 1265US6900529B2Electronic module having a three dimensional array of carrier-mounted integrated circuit packagesLEGACY ELECTRONICS INC·Filed 2002·Granted May 31, 2005·12 cites·25 claims
- 1351US2011019377A1Modular Integrated Circuit Chip CarrierKLEDZIK KENNETH J·Filed 2010·Application pending·0 cites
- 1450US5440519ASwitched memory expansion bufferMICRON SEMICONDUCTOR INC·Filed 1994·Granted Aug 8, 1995·15 cites·22 claims
- 1549US7337522B2Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chipsLEGACY ELECTRONICS INC·Filed 2005·Granted Mar 4, 2008·2 cites·14 claims
- 1647US7103970B2Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chipsLEGACY ELECTRONICS INC·Filed 2002·Granted Sep 12, 2006·2 cites·16 claims
- 1743US7316060B2System for populating a circuit board with semiconductor chipsLEGACY ELECTRONICS INC·Filed 2004·Granted Jan 8, 2008·1 cites·6 claims
- 1837US2003137808A1Electronic module having canopy-type carriersFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →