Inventor · disambiguated record
Kaimin Lv
Also filed as: Lv Kaimin
2 granted patents·12 pending applications·2 citations·filing 2021–2023
33Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0185US12426280B2Semiconductor structure with increased number of stacked memory dies and method of manufacturing the sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 23, 2025·2 cites·20 claims
- 0250US2024055399A1Semiconductor structure, method for manufacturing semiconductor structure, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0350US2024055408A1Semiconductor package structure and method for preparing semiconductor package structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0450US2024055333A1Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0550US2024057353A1Semiconductor package structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0648US2024055420A1Semiconductor package structure and manufacturing method thereforCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0747US2024057349A1Semiconductor package structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0847US2024057352A1Semiconductor structure and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0945US2024105706A1Semiconductor structure, method of forming same, and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1044US2024063187A1Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1142US2024071864A1Semiconductor structure, forming method of same and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1241US2024055404A1Semiconductor structure and method for forming same, and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1339US12033933B2Semiconductor structures and methods for forming the sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 9, 2024·0 cites·6 claims
- 1439US2024055409A1Semiconductor device and method for forming sameLv Kaimin·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kaimin Lv files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →