Inventor · disambiguated record
Joel M. Cook
Also filed as: COOK JOEL M · COOK JOEL MICHAEL
15 granted patents·2 pending applications·1,172 citations·filing 1983–2010
94Inventor score
Top patents by PatentIndex Score
17 records- 0197US6255221B1Methods for running a high density plasma etcher to achieve reduced transistor device damageLAM RES CORP·Filed 1998·Granted Jul 3, 2001·369 cites·29 claims
- 0297US5863376ATemperature controlling method and apparatus for a plasma processing chamberLAM RES CORP·Filed 1996·Granted Jan 26, 1999·281 cites·23 claims
- 0397US4498953AEtching techniquesAT & T BELL LAB·Filed 1983·Granted Feb 12, 1985·287 cites·22 claims
- 0494US5346579AMagnetic field enhanced plasma processing chamberAPPLIED MATERIALS INC·Filed 1993·Granted Sep 13, 1994·96 cites·8 claims
- 0571US6939796B2System, method and apparatus for improved global dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Sep 6, 2005·14 cites·20 claims
- 0670US6028286AMethod for igniting a plasma inside a plasma processing reactorLAM RES CORP·Filed 1998·Granted Feb 22, 2000·22 cites·30 claims
- 0766US8490573B2Method and apparatus for material depositionDORDI YEZDI·Filed 2010·Granted Jul 23, 2013·1 cites·10 claims
- 0864US7192875B1Processes for treating morphologically-modified silicon electrode surfaces using gas-phase interhalogensLAM RES CORP·Filed 2004·Granted Mar 20, 2007·5 cites·27 claims
- 0964US5783496AMethods and apparatus for etching self-aligned contactsLAM RES CORP·Filed 1996·Granted Jul 21, 1998·33 cites·21 claims
- 1063US7875554B2Method for electroless depositing a material on a surface of a waferLAM RES CORP·Filed 2008·Granted Jan 25, 2011·1 cites·21 claims
- 1163US6306244B1Apparatus for reducing polymer deposition on substrate supportLAM RES CORP·Filed 1999·Granted Oct 23, 2001·28 cites·29 claims
- 1259US6821899B2System, method and apparatus for improved local dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Nov 23, 2004·6 cites·27 claims
- 1355US6165910ASelf-aligned contacts for semiconductor deviceLAM RES CORP·Filed 1997·Granted Dec 26, 2000·20 cites·26 claims
- 1451US4554047ADownstream apparatus and techniqueAT & T BELL LAB·Filed 1984·Granted Nov 19, 1985·8 cites·9 claims
- 1547US7358186B2Method and apparatus for material deposition in semiconductor fabricationLAM RES CORP·Filed 2003·Granted Apr 15, 2008·1 cites·19 claims
- 1640US2010223190A1Methods and systems for operating a virtual network operations centerPEDERSEN SEAN MICHAEL·Filed 2010·Application pending·0 cites
- 1739US2002029853A1Methods for running a high density plasma etcher to achieve reduced transistor device damageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →