Inventor · disambiguated record
Jason C. Engle
Also filed as: ENGLE JASON · ENGLE JASON C
9 granted patents·2 pending applications·382 citations·filing 1999–2010
91Inventor score
Top patents by PatentIndex Score
11 records- 0190US7405471B2Carrier-based electronic moduleLEGACY ELECTRONICS INC·Filed 2003·Granted Jul 29, 2008·62 cites·29 claims
- 0290US6545868B1Electronic module having canopy-type carriersLEGACY ELECTRONICS INC·Filed 2000·Granted Apr 8, 2003·69 cites·30 claims
- 0389US6713854B1Electronic circuit module with a carrier having a mounting pad arrayLEGACY ELECTRONICS INC·Filed 2000·Granted Mar 30, 2004·63 cites·34 claims
- 0487US6487078B2Electronic module having a three dimensional array of carrier-mounted integrated circuit packagesLEGACY ELECTRONICS INC·Filed 2000·Granted Nov 26, 2002·49 cites·47 claims
- 0584US7102892B2Modular integrated circuit chip carrierLEGACY ELECTRONICS INC·Filed 2003·Granted Sep 5, 2006·29 cites·90 claims
- 0684US6313998B1Circuit board assembly having a three dimensional array of integrated circuit packagesLEGACY ELECTRONICS INC·Filed 1999·Granted Nov 6, 2001·88 cites·34 claims
- 0781US7796400B2Modular integrated circuit chip carrierLEGACY ELECTRONICS INC·Filed 2006·Granted Sep 14, 2010·8 cites·18 claims
- 0865US6900529B2Electronic module having a three dimensional array of carrier-mounted integrated circuit packagesLEGACY ELECTRONICS INC·Filed 2002·Granted May 31, 2005·12 cites·25 claims
- 0951US2011019377A1Modular Integrated Circuit Chip CarrierKLEDZIK KENNETH J·Filed 2010·Application pending·0 cites
- 1049US7337522B2Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chipsLEGACY ELECTRONICS INC·Filed 2005·Granted Mar 4, 2008·2 cites·14 claims
- 1137US2003137808A1Electronic module having canopy-type carriersFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →