Inventor · disambiguated record
Jae-Houb Chun
Also filed as: CHUN JAE HOUB
8 granted patents·22 citations·filing 2015–2022
82Inventor score
Files withSK HYNIX INC8
Top patents by PatentIndex Score
8 records- 0189US10522548B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2018·Granted Dec 31, 2019·7 cites·20 claims
- 0285US9589898B2Semiconductor device having air-gap and method for manufacturing the sameSK HYNIX INC·Filed 2015·Granted Mar 7, 2017·5 cites·10 claims
- 0382US10651176B2Method for forming a pattern and method for fabricating a semiconductor device using the sameSK HYNIX INC·Filed 2018·Granted May 12, 2020·4 cites·20 claims
- 0481US11424249B2Method for fabricating a semiconductor device having a trench exposing a sidewall of the contact plug aligned with the sidewall of the substrateSK HYNIX INC·Filed 2021·Granted Aug 23, 2022·1 cites·20 claims
- 0580US9780095B2Pattern forming method and semiconductor device manufacturing method using the sameSK HYNIX INC·Filed 2016·Granted Oct 3, 2017·3 cites·24 claims
- 0670US10861856B2Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2019·Granted Dec 8, 2020·1 cites·8 claims
- 0770US9941285B2Pattern forming method and semiconductor device manufacturing method using the sameSK HYNIX INC·Filed 2017·Granted Apr 10, 2018·1 cites·13 claims
- 0869US11882692B2Semiconductor device having trench positioned in a substrate and aligned with a side wall of a bit line contact plugSK HYNIX INC·Filed 2022·Granted Jan 23, 2024·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →