Inventor · disambiguated record
Hai San Tew
Also filed as: TEW HAI SAN
4 granted patents·1 pending application·0 citations·filing 2013–2018
52Inventor score
Top patents by PatentIndex Score
5 records- 0138US9609759B2Method and system for depositing an object onto a wiring boardTEW HAI SAN·Filed 2013·Granted Mar 28, 2017·0 cites·3 claims
- 0237US2019006239A1Integrated circuit package having pin-up interconnectQDOS FLEXCIRCUITS SDN BHD·Filed 2018·Application pending·0 cites
- 0335US10049935B2Integrated circuit package having pin up interconnectQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Aug 14, 2018·0 cites·13 claims
- 0422US10553475B2Single layer integrated circuit packageQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Feb 4, 2020·0 cites·1 claims
- 0522US10461004B2Integrated circuit substrate and method of producing thereofQDOS FLEXCIRCUITS SDN BHD·Filed 2017·Granted Oct 29, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →