Inventor · disambiguated record
Mohiuddin M. Mazumder
Also filed as: MAZUMDER MOHIUDDIN · MAZUMDER MOHIUDDIN M
13 granted patents·4 pending applications·169 citations·filing 1999–2023
90Inventor score
Top patents by PatentIndex Score
17 records- 0196US7402048B2Technique for blind-mating daughtercard to mainboardINTEL CORP·Filed 2006·Granted Jul 22, 2008·68 cites·12 claims
- 0290US8508947B2Flex cable and method for making the sameGANESAN SANKA·Filed 2010·Granted Aug 13, 2013·11 cites·15 claims
- 0388US11599497B2High performance interconnectINTEL CORP·Filed 2020·Granted Mar 7, 2023·2 cites·22 claims
- 0485US6191472B1Hole geometry of a semiconductor package substrateINTEL CORP·Filed 1999·Granted Feb 20, 2001·65 cites·19 claims
- 0583US12386768B2Extending multichip package link off packageINTEL CORP·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 0681US10678736B2Extending multichip package link off packageINTEL CORP·Filed 2015·Granted Jun 9, 2020·2 cites·11 claims
- 0780US10789201B2High performance interconnectINTEL CORP·Filed 2017·Granted Sep 29, 2020·3 cites·19 claims
- 0876US2023073807A1Extending multichip package link off packageINTEL CORP·Filed 2022·Application pending·0 cites
- 0975US7525723B2Circuit board-to-circuit board connectors having electro-optic modulatorsINTEL CORP·Filed 2006·Granted Apr 28, 2009·7 cites·23 claims
- 1073US11386033B2Extending multichip package link off packageINTEL CORP·Filed 2020·Granted Jul 12, 2022·0 cites·22 claims
- 1171US11113225B2Extending multichip package link off packageINTEL CORP·Filed 2020·Granted Sep 7, 2021·0 cites·9 claims
- 1255US7289945B2Analyzing interconnect structuresINTEL CORP·Filed 2002·Granted Oct 30, 2007·7 cites·2 claims
- 1350US7325208B2Method, apparatus and system for inductance modeling in an electrical configurationINTEL CORP·Filed 2004·Granted Jan 29, 2008·4 cites·31 claims
- 1437US2007237527A1Optical debug mechanismDABRAL SANJAY·Filed 2006·Application pending·0 cites
- 1537US2008122463A1Testing microelectronic devices using electro-optic modulator probesDABRAL SANJAY·Filed 2006·Application pending·0 cites
- 1636US10453795B2Microprocessor package with first level die bump ground webbing structureINTEL CORP·Filed 2015·Granted Oct 22, 2019·0 cites·17 claims
- 1735US2017351640A1Standardized retimerINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →