Assignee
GANESAN SANKA
US·7 granted patents·3 pending applications·127 citations·filing 2009–2016
Top patents by PatentIndex Score
10 records- 0196US8188594B2Input/output package architecturesGANESAN SANKA·Filed 2009·Granted May 29, 2012·59 cites·22 claims
- 0294US10170409B2Package on package architecture and method for makingGANESAN SANKA·Filed 2013·Granted Jan 1, 2019·22 cites·20 claims
- 0391US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 0490US8508947B2Flex cable and method for making the sameGANESAN SANKA·Filed 2010·Granted Aug 13, 2013·11 cites·15 claims
- 0588US10903166B2Integrated circuit packagesGANESAN SANKA·Filed 2016·Granted Jan 26, 2021·5 cites·25 claims
- 0686US9368437B2High density package interconnectsGANESAN SANKA·Filed 2011·Granted Jun 14, 2016·6 cites·28 claims
- 0766US9324678B2Low profile zero/low insertion force package top side flex cable connector architectureGANESAN SANKA·Filed 2011·Granted Apr 26, 2016·4 cites·13 claims
- 0850US2013292838A1Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2013·Application pending·0 cites
- 0947US2011122592A1First-level interconnects with slender columns, and processes of forming sameGANESAN SANKA·Filed 2009·Application pending·0 cites
- 1043US2015187608A1Die package architecture with embedded die and simplified redistribution layerGANESAN SANKA·Filed 2013·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →