Inventor · disambiguated record
Haijing Cao
Also filed as: CAO HAIJING
40 granted patents·2 pending applications·655 citations·filing 2005–2023
98Inventor score
Files withLIN YAOJIAN24STATS CHIPPAC LTD17SHANGHAI INSTITUTE FOR BIOMEDICAL AND PHARMACEUTICAL TECH1
Top patents by PatentIndex Score
42 records- 0198US8193604B2Semiconductor package with semiconductor core structure and method of forming the sameLIN YAOJIAN·Filed 2010·Granted Jun 5, 2012·152 cites·24 claims
- 0298US7858441B2Semiconductor package with semiconductor core structure and method of forming sameSTATS CHIPPAC LTD·Filed 2008·Granted Dec 28, 2010·75 cites·23 claims
- 0397US8445323B2Semiconductor package with semiconductor core structure and method of forming sameLIN YAOJIAN·Filed 2012·Granted May 21, 2013·37 cites·28 claims
- 0497US7993972B2Wafer level die integration and method thereforSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·46 cites·21 claims
- 0597US7772081B2Semiconductor device and method of forming high-frequency circuit structure and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·67 cites·18 claims
- 0697US7691747B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresSTATS CHIPPAC LTD·Filed 2007·Granted Apr 6, 2010·62 cites·19 claims
- 0794US8168470B2Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compoundLIN YAOJIAN·Filed 2008·Granted May 1, 2012·28 cites·27 claims
- 0894US7790503B2Semiconductor device and method of forming integrated passive device moduleSTATS CHIPPAC LTD·Filed 2007·Granted Sep 7, 2010·32 cites·22 claims
- 0992US8975111B2Wafer level die integration and method thereforLIN YAOJIAN·Filed 2011·Granted Mar 10, 2015·12 cites·34 claims
- 1089US8008770B2Integrated circuit package system with bump padSTATS CHIPPAC LTD·Filed 2006·Granted Aug 30, 2011·22 cites·20 claims
- 1186US8183087B2Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete componentLIN YAOJIAN·Filed 2008·Granted May 22, 2012·12 cites·16 claims
- 1285US8310058B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·6 cites·26 claims
- 1385US8304904B2Semiconductor device with solder bump formed on high topography plated Cu padsLIN YAOJIAN·Filed 2010·Granted Nov 6, 2012·6 cites·18 claims
- 1484US8592311B2Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structuresLIN YAOJIAN·Filed 2012·Granted Nov 26, 2013·5 cites·24 claims
- 1583US8409970B2Semiconductor device and method of making integrated passive devicesLIN YAOJIAN·Filed 2007·Granted Apr 2, 2013·10 cites·32 claims
- 1683US8263437B2Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuitLIN YAOJIAN·Filed 2008·Granted Sep 11, 2012·7 cites·29 claims
- 1783US8110477B2Semiconductor device and method of forming high-frequency circuit structure and method thereofLIN YAOJIAN·Filed 2010·Granted Feb 7, 2012·6 cites·25 claims
- 1882US7935570B2Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillarsSTATS CHIPPAC LTD·Filed 2008·Granted May 3, 2011·9 cites·21 claims
- 1981US8124490B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2007·Granted Feb 28, 2012·9 cites·32 claims
- 2080US8309452B2Method of forming an inductor on a semiconductor waferLIN YAOJIAN·Filed 2010·Granted Nov 13, 2012·4 cites·24 claims
- 2180US7749814B2Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrateSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·9 cites·25 claims
- 2279US9865482B2Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete componentLIN YAOJIAN·Filed 2012·Granted Jan 9, 2018·4 cites·20 claims
- 2379US7682959B2Method of forming solder bump on high topography plated CuSTATS CHIPPAC LTD·Filed 2007·Granted Mar 23, 2010·7 cites·22 claims
- 2478US9349723B2Semiconductor device and method of forming passive devicesLIN YAOJIAN·Filed 2012·Granted May 24, 2016·4 cites·14 claims
- 2576US10211183B2Semiconductor device and method of forming shielding layer over integrated passive device using conductive channelsSTATS CHIPPAC LTD·Filed 2016·Granted Feb 19, 2019·2 cites·21 claims
- 2675US10192801B2Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compoundLIN YAOJIAN·Filed 2012·Granted Jan 29, 2019·3 cites·26 claims
- 2774US7727876B2Semiconductor device and method of protecting passivation layer in a solder bump processSTATS CHIPPAC LTD·Filed 2007·Granted Jun 1, 2010·5 cites·19 claims
- 2872US7772106B2Method of forming an inductor on a semiconductor waferSTATS CHIPPAC LTD·Filed 2007·Granted Aug 10, 2010·4 cites·20 claims
- 2969US9184103B2Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillarsLIN YAOJIAN·Filed 2011·Granted Nov 10, 2015·2 cites·25 claims
- 3064US9337141B2Method of forming an inductor on a semiconductor waferSTATS CHIPPAC LTD·Filed 2012·Granted May 10, 2016·1 cites·25 claims
- 3164US8026593B2Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereofSTATS CHIPPAC LTD·Filed 2007·Granted Sep 27, 2011·2 cites·10 claims
- 3263US9449925B2Integrated passive devicesSTATS CHIPPAC LTD·Filed 2013·Granted Sep 20, 2016·1 cites·18 claims
- 3363US8389396B2Method for manufacture of integrated circuit package system with protected conductive layers for padsLIN YAOJIAN·Filed 2011·Granted Mar 5, 2013·1 cites·10 claims
- 3461US8395053B2Circuit system with circuit element and reference planeLIN YAOJIAN·Filed 2007·Granted Mar 12, 2013·1 cites·20 claims
- 3561US7381634B2Integrated circuit system for bondingSTATS CHIPPAC LTD·Filed 2005·Granted Jun 3, 2008·2 cites·18 claims
- 3660US2025345344A1Novel nrf2 activator and use thereofSHANGHAI INSTITUTE FOR BIOMEDICAL AND PHARMACEUTICAL TECH·Filed 2023·Application pending·0 cites
- 3754US9240384B2Semiconductor device with solder bump formed on high topography plated Cu padsSTATS CHIPPAC LTD·Filed 2012·Granted Jan 19, 2016·0 cites·16 claims
- 3853US9269598B2Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuitLIN YAOJIAN·Filed 2012·Granted Feb 23, 2016·0 cites·19 claims
- 3952US9324700B2Semiconductor device and method of forming shielding layer over integrated passive device using conductive channelsLIN YAOJIAN·Filed 2008·Granted Apr 26, 2016·0 cites·27 claims
- 4045US2012211881A9Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump ProcessLIN YAOJIAN·Filed 2010·Application pending·0 cites
- 4144US8669637B2Integrated passive device systemLIN YAOJIAN·Filed 2006·Granted Mar 11, 2014·0 cites·15 claims
- 4240US8134196B2Integrated circuit system with metal-insulator-metal circuit elementLIN YAOJIAN·Filed 2006·Granted Mar 13, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →