Inventor · disambiguated record
Isao Yokokawa
Also filed as: YOKOKAWA ISAO
32 granted patents·8 pending applications·498 citations·filing 1999–2021
97Inventor score
Top patents by PatentIndex Score
40 records- 0191US7315064B2Bonded wafer and method of producing bonded waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jan 1, 2008·20 cites·5 claims
- 0289US7052974B2Bonded wafer and method of producing bonded waferSHINETSU HANDOTAI KK·Filed 2002·Granted May 30, 2006·47 cites·16 claims
- 0388US6284629B1Method of fabricating an SOI wafer and SOI wafer fabricated by the methodSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 4, 2001·78 cites·11 claims
- 0488US6245645B1Method of fabricating an SOI waferSHINETSU HANDOTAI KK·Filed 1999·Granted Jun 12, 2001·80 cites·16 claims
- 0587US7084046B2Method of fabricating SOI waferSHINETSU HANDOTAI KK·Filed 2002·Granted Aug 1, 2006·46 cites·26 claims
- 0686US6566233B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2000·Granted May 20, 2003·44 cites·8 claims
- 0786US6306730B2Method of fabricating an SOI wafer and SOI wafer fabricated by the methodSHINETSU HANDOTAI KK·Filed 2001·Granted Oct 23, 2001·29 cites·1 claims
- 0885US7550309B2Method for producing semiconductor waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jun 23, 2009·10 cites·8 claims
- 0985US6312797B1Method for manufacturing bonded wafer and bonded waferSHINETSU HANDOTAI KK·Filed 1999·Granted Nov 6, 2001·74 cites·9 claims
- 1082US8956951B2Method for manufacturing SOI waferYOKOKAWA ISAO·Filed 2010·Granted Feb 17, 2015·6 cites·9 claims
- 1175US6959854B2Production method for bonded substratesSHINETSU HANDOTAI KK·Filed 2002·Granted Nov 1, 2005·17 cites·18 claims
- 1274US6900113B2Method for producing bonded wafer and bonded waferSHINETSU HANDOTAI KK·Filed 2001·Granted May 31, 2005·21 cites·11 claims
- 1372US7521265B2Method for measuring an amount of strain of a bonded strained waferSHINETSU HANDOTAI KK·Filed 2005·Granted Apr 21, 2009·5 cites·18 claims
- 1470US8053334B2Method for forming silicon oxide film of SOI waferSHINETSU HANDOTAI KK·Filed 2008·Granted Nov 8, 2011·3 cites·8 claims
- 1568US8361888B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2008·Granted Jan 29, 2013·2 cites·6 claims
- 1667US8906708B2Method for checking ion implantation condition and method for manufacturing semiconductor waferYOKOKAWA ISAO·Filed 2011·Granted Dec 9, 2014·2 cites·14 claims
- 1764US9337080B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted May 10, 2016·1 cites·15 claims
- 1863US9673086B2Method of producing bonded waferSHINETSU HANDOTAI KK·Filed 2014·Granted Jun 6, 2017·1 cites·20 claims
- 1963US9076840B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jul 7, 2015·1 cites·4 claims
- 2059US8728912B2Method for manufacturing SOI waferAGA HIROJI·Filed 2011·Granted May 20, 2014·1 cites·2 claims
- 2158US7091107B2Method for producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2004·Granted Aug 15, 2006·8 cites·8 claims
- 2250US2023268222A1Method for manufacturing soi wafer and soi waferSHINETSU HANDOTAI KK·Filed 2021·Application pending·0 cites
- 2347US9865497B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2014·Granted Jan 9, 2018·0 cites·6 claims
- 2447US7985660B2Method for manufacturing soi waferSHINETSU HANDOTAI KK·Filed 2008·Granted Jul 26, 2011·0 cites·14 claims
- 2545US7608548B2Method for cleaning a multilayer substrate and method for bonding substrates and method for producing a bonded waferSHINETSU HANDOTAI KK·Filed 2004·Granted Oct 27, 2009·1 cites·13 claims
- 2645US7524744B2Method of producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2004·Granted Apr 28, 2009·1 cites·5 claims
- 2744US10763157B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2017·Granted Sep 1, 2020·0 cites·10 claims
- 2844US7959731B2Method for producing semiconductor waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jun 14, 2011·0 cites·13 claims
- 2944US2015340279A1Method for manufacturing soi wafer and soi waferSHINETSU HANDOTAI KK·Filed 2013·Application pending·0 cites
- 3043US10886163B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2018·Granted Jan 5, 2021·0 cites·2 claims
- 3142US8962352B2Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI waferYOKOKAWA ISAO·Filed 2012·Granted Feb 24, 2015·0 cites·8 claims
- 3242US2007287269A1Method For Producing Semiconductor WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 3341US10347525B2Method for producing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Jul 9, 2019·0 cites·8 claims
- 3441US2008315349A1Method for Manufacturing Bonded Wafer and Bonded WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 3540US2001046746A1Method of fabricating an SOI wafer and SOI wafer fabricated by the methodSHINETSU HANDOTAI KK·Filed 2001·Application pending·0 cites
- 3639US10204824B2Method for producing SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Feb 12, 2019·0 cites·3 claims
- 3738US8987109B2Method for manufacturing bonded wafer and bonded SOI waferAGA HIROJI·Filed 2012·Granted Mar 24, 2015·0 cites·17 claims
- 3838US2005118789A1Method of producing soi wafer and soi waferSHINETSU HANDOTAI KK·Filed 2003·Application pending·0 cites
- 3936US2002157790A1Method for producing a bonded wafer using ion implantation delaminationFiled 2001·Application pending·0 cites
- 4032US2011281420A1Method for manufacturing soi waferAGA HIROJI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →