Assignee
YOKOKAWA ISAO
JP·3 granted patents·8 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0182US8956951B2Method for manufacturing SOI waferYOKOKAWA ISAO·Filed 2010·Granted Feb 17, 2015·6 cites·9 claims
- 0267US8906708B2Method for checking ion implantation condition and method for manufacturing semiconductor waferYOKOKAWA ISAO·Filed 2011·Granted Dec 9, 2014·2 cites·14 claims
- 0342US8962352B2Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI waferYOKOKAWA ISAO·Filed 2012·Granted Feb 24, 2015·0 cites·8 claims
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