Inventor · disambiguated record
Hee Min Shin
Also filed as: SHIN HEE MIN
8 granted patents·3 pending applications·46 citations·filing 2008–2016
81Inventor score
Top patents by PatentIndex Score
11 records- 0192US8564141B2Chip unit and stack package having the sameLEE KYU WON·Filed 2011·Granted Oct 22, 2013·32 cites·16 claims
- 0281US9842809B2Semiconductor packages having EMI shielding parts and methods of fabricating the sameSK HYNIX INC·Filed 2016·Granted Dec 12, 2017·6 cites·19 claims
- 0380US9093441B2Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the sameSK HYNIX INC·Filed 2013·Granted Jul 28, 2015·6 cites·19 claims
- 0463US9082634B2Stack package and method for manufacturing the sameSHIN HEE-MIN·Filed 2010·Granted Jul 14, 2015·2 cites·11 claims
- 0548US2013256887A1Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 0647US8951810B2Methods for forming interconnection line using screen printing techniqueSK HYNIX INC·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 0747US2010092718A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersSHIN HEE MIN·Filed 2008·Application pending·0 cites
- 0846US9305912B2Stack package and method for manufacturing the sameSK HYNIX INC·Filed 2015·Granted Apr 5, 2016·0 cites·6 claims
- 0945US2011189928A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 1044US8476751B2Stacked semiconductor package and method for manufacturing the sameLEE KYU WON·Filed 2011·Granted Jul 2, 2013·0 cites·13 claims
- 1139US9659909B2Semiconductor packages including flexible wing interconnection substrateSK HYNIX INC·Filed 2016·Granted May 23, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →