Inventor · disambiguated record
Yi-Che Lai
Also filed as: LAI YI-CHE
23 granted patents·12 pending applications·86 citations·filing 2012–2017
93Inventor score
Top patents by PatentIndex Score
35 records- 0196US10062651B2Packaging substrate and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 28, 2018·48 cites·20 claims
- 0288US9324582B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Apr 26, 2016·9 cites·11 claims
- 0385US9899308B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 20, 2018·4 cites·28 claims
- 0481US10199341B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·10 claims
- 0577US9520304B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·34 claims
- 0675US9875981B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 23, 2018·2 cites·2 claims
- 0774US8952537B2Conductive bump structure with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 10, 2015·3 cites·8 claims
- 0872US10049975B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 14, 2018·2 cites·7 claims
- 0971US8952528B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 10, 2015·2 cites·11 claims
- 1070US9607939B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·21 claims
- 1169US9502333B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·2 cites·11 claims
- 1267US9666536B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 30, 2017·1 cites·12 claims
- 1365US9269693B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 23, 2016·1 cites·9 claims
- 1464US9087780B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 1555US9720013B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Aug 1, 2017·1 cites·11 claims
- 1650US9257381B2Semiconductor package, and interposer structure of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 9, 2016·0 cites·9 claims
- 1749US9418874B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·9 claims
- 1849US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1948US9627226B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Apr 18, 2017·0 cites·26 claims
- 2048US9548220B2Method of fabricating semiconductor package having an interposer structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 17, 2017·0 cites·14 claims
- 2148US9349705B2Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 24, 2016·0 cites·15 claims
- 2248US2017236783A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2346US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2444US9754898B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·18 claims
- 2542US8987012B2Method of testing a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 2642US2015014864A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2741US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2840US2014127864A1Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 2940US2014008819A1Substrate structure, semiconductor package and methods of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 3038US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 3138US2014077387A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 3237US2014191386A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3334US2014073087A1Method of fabricating a semiconductor packageHUANG PIN-CHENG·Filed 2012·Application pending·0 cites
- 3433US2017053859A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3530US2017311445A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
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