Package structure

Abstract

The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

1 - 12 . (canceled) 
     
     
         13 . A package structure, comprising:
 a dielectric layer;   an encapsulating layer formed on the dielectric layer, for the dielectric layer and the encapsulating layer to form an encapsulant body having opposing first and second surfaces, wherein the first surface is an outer surface of the dielectric layer, while the second surface is an outer surface of the encapsulating layer;   at least one first electronic component disposed on the dielectric layer and embedded in the encapsulating layer; and   a plurality of conductive pillars embedded in the encapsulating layer and the dielectric layer, wherein each of the conductive pillars has opposing first and second ends, and the first end is exposed from the first surface while the second end is exposed from the second surface.   
     
     
         14 . The package structure of  claim 13 , wherein the first end of each of the conductive pillars is flush with the first surface of the encapsulant body. 
     
     
         15 . The package structure of  claim 13 , wherein each of the second end of the conductive pillars is flush with the second surface of the encapsulant body. 
     
     
         16 . The package structure of  claim 13 , further comprising a redistribution layer formed on the first surface of the encapsulant body and electrically connected with the first end of each of the conductive pillars and the first electronic component. 
     
     
         17 . The package structure of  claim 16 , further comprising a plurality of conductive elements formed on the redistribution layer. 
     
     
         18 . The package structure of  claim 13 , wherein the first electronic component is exposed from the second surface of the encapsulant body. 
     
     
         19 . The package structure of  claim 13 , wherein the electronic component is not exposed from the second surface of the encapsulant body. 
     
     
         20 . The package structure of  claim 13 , further comprising a redistribution layer formed on the second surface of the encapsulant body and electrically connected with the second end of each of the conductive pillars. 
     
     
         21 . The package structure of  claim 20 , further comprising a second electronic component disposed on the redistribution layer and electrically connected with the redistribution layer. 
     
     
         22 . The package structure of  claim 21 , wherein the second electronic component is electrically connected with the redistribution layer via a plurality of conductive elements. 
     
     
         23 . The package structure of  claim 13 , further comprising a second electronic component disposed on the encapsulating layer and electrically connected with the second end of each of the conductive pillars. 
     
     
         24 . The package structure of  claim 23 , wherein the second electronic component is electrically connected with of the second end of each of the conductive pillars via a plurality of conductive elements.