Inventor · disambiguated record
Kazuhisa Tsunoi
Also filed as: TSUNOI KAZUHISA
7 granted patents·3 pending applications·162 citations·filing 1985–2012
86Inventor score
Files withFUJITSU LTD10
Top patents by PatentIndex Score
10 records- 0184US4675789AHigh density multilayer printed circuit boardFUJITSU LTD·Filed 1985·Granted Jun 23, 1987·54 cites·3 claims
- 0276US6429516B1Structure for mounting a bare chip using an interposerFUJITSU LTD·Filed 1997·Granted Aug 6, 2002·43 cites·4 claims
- 0366US6482676B2Method of mounting semiconductor chip part on substrateFUJITSU LTD·Filed 1997·Granted Nov 19, 2002·35 cites·19 claims
- 0461US6177730B1Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chipFUJITSU LTD·Filed 1998·Granted Jan 23, 2001·22 cites·3 claims
- 0545US2013087375A1Multilayer wiring substrate, electronic device, and manufacturing method of multilayer wiring substrateFUJITSU LTD·Filed 2012·Application pending·0 cites
- 0640US2010200643A1Method for producing electronic part unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 0739US6787925B2Mounting method of semiconductor deviceFUJITSU LTD·Filed 2001·Granted Sep 7, 2004·0 cites·1 claims
- 0836US2011220405A1Method for manufacturing multilayer printed wiring board and multilayer printed wiring boardFUJITSU LTD·Filed 2010·Application pending·0 cites
- 0935US6458237B1Mounting method of semiconductor deviceFUJITSU LTD·Filed 1998·Granted Oct 1, 2002·4 cites·10 claims
- 1035US6291269B1Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chipFUJITSU LTD·Filed 1999·Granted Sep 18, 2001·4 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →