Method for manufacturing multilayer printed wiring board and multilayer printed wiring board

Abstract

A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in a second insulating substrate that has the same shape and the same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having the same shape and the same size as a shape and a size, respectively, of the first through holes and being formed at the same positions as positions at which the first through holes are formed. At least one of the first through holes is filled with a first conductive member and at least one of the second through holes is filled with a second conductive member. And stacking the first insulating substrate and the second insulating substrate together.

1 . A method for manufacturing a multilayer printed wiring board, the method comprising:
 forming a group of first through holes in a first insulating substrate;   forming a group of second through holes in a second insulating substrate that has same shape and same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having same shape and same size as a shape and a size, respectively, of the first through holes and being formed at same positions as positions at which the first through holes are formed;   filling at least one of the first through holes with a first conductive member;   filling at least one of the second through holes with a second conductive member; and   stacking the first insulating substrate and the second insulating substrate together.   
     
     
         2 . The method according to  claim 1 , the method further comprising:
 filling at least one of the first through holes with a first insulating member; and   forming a wiring pattern on the first insulating substrate such that the wiring pattern passes the insulating member.   
     
     
         3 . The method according to  claim 1 , wherein at least one of the first through holes is hollow. 
     
     
         4 . The method according to  claim 1 , wherein upon the filling of the first through holes, the first conductive member projects from and/or does not project from the first insulating substrate. 
     
     
         5 . The method according to  claim 4 , wherein when the first conductive member projects from the first insulating substrate, the first conductive member has a substantially truncated conical shape with one or more projections formed on a tip of the truncated cone and/or a substantially conical shape. 
     
     
         6 . A multilayer printed wiring board, comprising:
 a first insulating substrate provided with a group of first through holes;   a second insulating substrate having same shape and same size as a shape and a size, respectively, of the first insulating substrate and stacked on the first insulating substrate, the second insulating substrate being provided with a group of second through holes having same shape and same size as a shape and a size, respectively, of the first through holes and provided at same positions as positions at which the first through holes are provided;   a first conductive member with which at least one of the first through holes is filled; and   a second conductive member with which at least one of the second through holes is filled.   
     
     
         7 . The multilayer printed wiring board according to  claim 6 , further comprising:
 an insulating member with which at least one of the first through holes is filled; and   a wiring pattern formed on the first insulating substrate such that the wiring pattern passes the insulating member.   
     
     
         8 . The multilayer printed wiring board according to  claim 6 , wherein at least one of the first through holes is hollow. 
     
     
         9 . The multilayer printed wiring board according to  claim 6 , wherein the first conductive member projects from and/or does not project from the first insulating substrate. 
     
     
         10 . The multiplayer printed wiring board according to  claim 9 , wherein when the first conductive member projects from the first insulating substrate, the first conductive member has a substantially truncated conical shape with one or more projections formed on a tip of the truncated cone and/or a substantially conical shape.