Inventor · disambiguated record
Lap Kei Chow
Also filed as: CHOW LAP KEI · CHOW LAP KEI ERIC
15 granted patents·1 pending application·113 citations·filing 2001–2018
90Inventor score
Files withASM ASSEMBLY AUTOMATION LTD7CHENG CHI WAH5ASM TECH SINGAPORE PTE LTD2CHOW LAP KEI ERIC1KWOK CHI HANG1
Top patents by PatentIndex Score
16 records- 0197US7495759B1Damage and wear detection for rotary cutting bladesASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Feb 24, 2009·42 cites·14 claims
- 0282US6967475B2Device transfer mechanism for a test handlerASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Nov 22, 2005·27 cites·24 claims
- 0379US6806725B2Method and apparatus for processing an array of packaged semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2002·Granted Oct 19, 2004·31 cites·24 claims
- 0477US8167524B2Handling system for inspecting and sorting electronic componentsCHENG CHI WAH·Filed 2007·Granted May 1, 2012·6 cites·11 claims
- 0562US8289388B2Alignment method for singulation systemCHENG CHI WAH·Filed 2009·Granted Oct 16, 2012·1 cites·8 claims
- 0660US7849847B2Drainage apparatus for a singulation systemASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Dec 14, 2010·1 cites·19 claims
- 0749US11011435B2Apparatus and method inspecting bonded semiconductor diceASM TECH SINGAPORE PTE LTD·Filed 2018·Granted May 18, 2021·0 cites·17 claims
- 0845US8167523B2Singulation handler comprising vision systemCHENG CHI WAH·Filed 2007·Granted May 1, 2012·0 cites·9 claims
- 0944US8709916B2Laser processing method and apparatusKWOK CHI HANG·Filed 2012·Granted Apr 29, 2014·0 cites·3 claims
- 1044US6783316B2Apparatus and method for testing semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Aug 31, 2004·4 cites·18 claims
- 1142US8538576B2Method of configuring a dicing device, and a dicing apparatus for dicing a workpieceCHENG CHI WAH·Filed 2011·Granted Sep 17, 2013·0 cites·18 claims
- 1241US9016675B2Apparatus and method for supporting a workpiece during processingCHENG CHI WAH·Filed 2012·Granted Apr 28, 2015·0 cites·10 claims
- 1340US8702017B2Nozzle device employing high frequency wave energyCHOW LAP KEI ERIC·Filed 2008·Granted Apr 22, 2014·0 cites·12 claims
- 1436US8354612B2Laser processing apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2010·Granted Jan 15, 2013·0 cites·22 claims
- 1535US7486092B2Apparatus for supporting semiconductor devices during testingASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Feb 3, 2009·1 cites·17 claims
- 1634US2019067049A1Radiative wafer cutting using selective focusing depthsASM TECH SINGAPORE PTE LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →