Assignee
CHENG CHI WAH
HK·16 granted patents·2 pending applications·52 citations·filing 2007–2014
Top patents by PatentIndex Score
18 records- 0186US8251422B2Apparatus for transferring electronic components in stagesCHENG CHI WAH·Filed 2010·Granted Aug 28, 2012·10 cites·12 claims
- 0282US9218995B2Transfer apparatus for transferring electronic devices and changing their orientationsCHENG CHI WAH·Filed 2014·Granted Dec 22, 2015·6 cites·15 claims
- 0381US8967368B2Apparatus for processing electronic devicesCHENG CHI WAH·Filed 2013·Granted Mar 3, 2015·5 cites·13 claims
- 0479US8657181B2Wedge bonder and a method of cleaning a wedge bonderCHENG CHI WAH·Filed 2012·Granted Feb 25, 2014·6 cites·20 claims
- 0579US8434669B1Universal bond head for wire bondersCHENG CHI WAH·Filed 2012·Granted May 7, 2013·6 cites·8 claims
- 0677US8167524B2Handling system for inspecting and sorting electronic componentsCHENG CHI WAH·Filed 2007·Granted May 1, 2012·6 cites·11 claims
- 0777US8091762B1Wedge bonding method incorporating remote pattern recognition systemCHENG CHI WAH·Filed 2010·Granted Jan 10, 2012·6 cites·15 claims
- 0871US9508570B2Singulation apparatus and methodCHENG CHI WAH·Filed 2013·Granted Nov 29, 2016·4 cites·5 claims
- 0962US8289388B2Alignment method for singulation systemCHENG CHI WAH·Filed 2009·Granted Oct 16, 2012·1 cites·8 claims
- 1060US9263352B2Singulation apparatus comprising an imaging deviceCHENG CHI WAH·Filed 2014·Granted Feb 16, 2016·1 cites·19 claims
- 1158US8978673B2Megasonic cleaning systemCHENG CHI WAH·Filed 2007·Granted Mar 17, 2015·1 cites·17 claims
- 1247US2008164646A1Workholder for supporting electronic devicesCHENG CHI WAH·Filed 2007·Application pending·0 cites
- 1346US9461013B2Wire spool system for a wire bonding apparatusCHENG CHI WAH·Filed 2014·Granted Oct 4, 2016·0 cites·6 claims
- 1445US8167523B2Singulation handler comprising vision systemCHENG CHI WAH·Filed 2007·Granted May 1, 2012·0 cites·9 claims
- 1545US2009148258A1Pick and place apparatus incorporating debris removal deviceCHENG CHI WAH·Filed 2007·Application pending·0 cites
- 1642US8538576B2Method of configuring a dicing device, and a dicing apparatus for dicing a workpieceCHENG CHI WAH·Filed 2011·Granted Sep 17, 2013·0 cites·18 claims
- 1741US9016675B2Apparatus and method for supporting a workpiece during processingCHENG CHI WAH·Filed 2012·Granted Apr 28, 2015·0 cites·10 claims
- 1832US9519007B2Handling system for testing electronic componentsCHENG CHI WAH·Filed 2013·Granted Dec 13, 2016·0 cites·19 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →