Inventor · disambiguated record
Satoru Katsurayama
Also filed as: KATSURAYAMA SATORU
11 granted patents·6 pending applications·83 citations·filing 2006–2013
89Inventor score
Top patents by PatentIndex Score
17 records- 0191US7829992B2Semiconductor device and method for manufacturing semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Granted Nov 9, 2010·30 cites·16 claims
- 0290US8008122B1Pressurized underfill cureIBM·Filed 2010·Granted Aug 30, 2011·13 cites·24 claims
- 0383US8652941B2Wafer dicing employing edge region underfill removalINDYK RICHARD F·Filed 2012·Granted Feb 18, 2014·10 cites·25 claims
- 0479US8319350B2Adhesive tape and semiconductor device using the sameKATSURAYAMA SATORU·Filed 2007·Granted Nov 27, 2012·9 cites·8 claims
- 0577US8597785B2Adhesive filmKOMIYATANI TOSHIO·Filed 2007·Granted Dec 3, 2013·7 cites·4 claims
- 0668US8629564B2Semiconductor electronic component and semiconductor device using the sameKATSURAYAMA SATORU·Filed 2007·Granted Jan 14, 2014·4 cites·27 claims
- 0765US8039305B2Method for bonding semiconductor wafers and method for manufacturing semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Oct 18, 2011·5 cites·20 claims
- 0858US8169090B2Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the sameKATSURAYAMA SATORU·Filed 2006·Granted May 1, 2012·3 cites·25 claims
- 0958US7838984B2Adhesive tape, connected structure and semiconductor packageSUMITOMO BAKELITE CO·Filed 2007·Granted Nov 23, 2010·1 cites·11 claims
- 1053US2010155964A1Adhesive Tape, Semiconductor Package and ElectronicsSUMITOMO BAKELITE CO·Filed 2007·Application pending·0 cites
- 1153US2011068483A1Method of manufacturing a semiconductor device and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 1252US8531028B2Method for manufacturing electronic component, and electronic componentMAEJIMA KENZOU·Filed 2010·Granted Sep 10, 2013·1 cites·18 claims
- 1347US2013324641A1Method for manufacturing electronic component, and electronic componentSUMITOMO BAKELITE CO·Filed 2013·Application pending·0 cites
- 1445US2011311790A1Conductive connecting material, method for connecting terminals using the conductive connecting material, and method for producing a connecting terminalOKADA WATARU·Filed 2009·Application pending·0 cites
- 1542US2011262697A1Flexible substrate and electronic deviceKATSURAYAMA SATORU·Filed 2009·Application pending·0 cites
- 1641US8704378B2Semiconductor deviceSUGINO MITSUO·Filed 2007·Granted Apr 22, 2014·0 cites·18 claims
- 1727US2012156502A1Adhesive film, multilayer circuit board, electronic component and semiconductor deviceMAEJIMA KENZOU·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Satoru Katsurayama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →