Method for manufacturing electronic component, and electronic component

Abstract

Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.

1 . A resin film comprising a thermosetting resin. 
     
     
         2 . The resin film according to  claim 1 , wherein the thermosetting resin includes an epoxy resin. 
     
     
         3 . The resin film according to  claim 1 , wherein the resin film comprises a flux activating compound. 
     
     
         4 . The resin film according to  claim 1 , wherein the amount of the thermosetting resin in the resin film is 25% to 90% by weight. 
     
     
         5 . The resin film according to  claim 2 , wherein the epoxy resin comprises an epoxy resin which is liquid at room temperature. 
     
     
         6 . The resin film according to  claim 1 , wherein the resin film comprises a curing agent. 
     
     
         7 . The resin film according to  claim 6 , wherein the curing agent is at least one selected from the group consisting of phenols, amines and thiols. 
     
     
         8 . The resin film according to  claim 3 , wherein the flux activating compound is a compound having a carboxyl group and/or a phenolic hydroxyl group. 
     
     
         9 . The resin film according to  claim 3 , wherein the amount of the flux activating compound in the resin film is 1% to 30% by weight. 
     
     
         10 . The resin film according to  claim 1 , wherein the resin film comprises a film-forming resin. 
     
     
         11 . The resin film according to  claim 10 , wherein the film-forming resin is at least one selected from the group consisting of a (meth)acrylic resin, a phenoxy resin, and a polyamide resin. 
     
     
         12 . The resin film according to  claim 1 , wherein the resin film comprises an inorganic filler material.