Inventor · disambiguated record
Jaydeep Sinha
Also filed as: SINHA JAYDEEP · SINHA JAYDEEP K · SINHA JAYDEEP KUMAR
41 granted patents·2 pending applications·287 citations·filing 2000–2019
97Inventor score
Top patents by PatentIndex Score
43 records- 0196US9355440B1Detection of selected defects in relatively noisy inspection dataKLA TENCOR CORP·Filed 2012·Granted May 31, 2016·28 cites·35 claims
- 0296US9087176B1Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process controlKLA TENCOR CORP·Filed 2014·Granted Jul 21, 2015·57 cites·20 claims
- 0394US10788759B2Prediction based chucking and lithography control optimizationKLA TENCOR CORP·Filed 2018·Granted Sep 29, 2020·5 cites·27 claims
- 0491US10401279B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2014·Granted Sep 3, 2019·10 cites·25 claims
- 0591US10025894B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2016·Granted Jul 17, 2018·7 cites·19 claims
- 0690US9779202B2Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurementsKLA TENCOR CORP·Filed 2015·Granted Oct 3, 2017·9 cites·17 claims
- 0790US9702829B1Systems and methods for wafer surface feature detection and quantificationKLA TENCOR CORP·Filed 2014·Granted Jul 11, 2017·12 cites·25 claims
- 0890US9430593B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2013·Granted Aug 30, 2016·10 cites·36 claims
- 0989US9354526B2Overlay and semiconductor process control using a wafer geometry metricVUKKADALA PRADEEP·Filed 2012·Granted May 31, 2016·15 cites·37 claims
- 1089US8768665B2Site based quantification of substrate topography and its relation to lithography defocus and overlayVEERARAGHAVAN SATHISH·Filed 2010·Granted Jul 1, 2014·13 cites·21 claims
- 1188US10352691B1Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry toolKLA TENCOR CORP·Filed 2014·Granted Jul 16, 2019·10 cites·22 claims
- 1288US9865047B1Systems and methods for effective pattern wafer surface measurement and analysis using interferometry toolKLA TENCOR CORP·Filed 2015·Granted Jan 9, 2018·7 cites·29 claims
- 1385US9546862B2Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2012·Granted Jan 17, 2017·6 cites·14 claims
- 1484US7324917B2Method, system, and software for evaluating characteristics of a surface with reference to its edgeKLA TENCOR TECH CORP·Filed 2005·Granted Jan 29, 2008·13 cites·54 claims
- 1583US10249523B2Overlay and semiconductor process control using a wafer geometry metricKLA TENCOR CORP·Filed 2016·Granted Apr 2, 2019·3 cites·10 claims
- 1683US9707660B2Predictive wafer modeling based focus error prediction using correlations of wafersKLA TENCOR CORP·Filed 2014·Granted Jul 18, 2017·4 cites·28 claims
- 1779US9632038B2Hybrid phase unwrapping systems and methods for patterned wafer measurementKLA TENCOR CORP·Filed 2015·Granted Apr 25, 2017·3 cites·21 claims
- 1879US9177370B2Systems and methods of advanced site-based nanotopography for wafer surface metrologyKLA TENCOR CORP·Filed 2013·Granted Nov 3, 2015·5 cites·52 claims
- 1979US7853429B2Curvature-based edge bump quantificationKLA TENCOR CORP·Filed 2007·Granted Dec 14, 2010·11 cites·10 claims
- 2078US10379061B1Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2017·Granted Aug 13, 2019·2 cites·14 claims
- 2177US6538733B2Ring chuck to hold 200 and 300 mm waferADE CORP·Filed 2001·Granted Mar 25, 2003·18 cites·10 claims
- 2274US9029810B2Using wafer geometry to improve scanner correction effectiveness for overlay controlKLA TENCOR CORP·Filed 2014·Granted May 12, 2015·2 cites·20 claims
- 2374US7629798B2Wafer edge-defect detection and capacitive probe thereforKLA TENCOR CORP·Filed 2007·Granted Dec 8, 2009·6 cites·14 claims
- 2473US9031810B2Methods and systems of object based metrology for advanced wafer surface nanotopographyCHEN HAIGUANG·Filed 2011·Granted May 12, 2015·3 cites·13 claims
- 2572US8065109B2Localized substrate geometry characterizationVEERARAGHAVAN SATHISH·Filed 2009·Granted Nov 22, 2011·5 cites·49 claims
- 2667US9513565B2Using wafer geometry to improve scanner correction effectiveness for overlay controlKLA TENCOR CORP·Filed 2015·Granted Dec 6, 2016·1 cites·19 claims
- 2763US8630479B2Methods and systems for improved localized feature quantification in surface metrology toolsCHEN HAIGUANG·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 2861US11761880B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2019·Granted Sep 19, 2023·0 cites·20 claims
- 2961US10330608B2Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology toolsCHEN HAIGUANG·Filed 2012·Granted Jun 25, 2019·1 cites·25 claims
- 3061US9558545B2Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometryKLA TENCOR CORP·Filed 2015·Granted Jan 31, 2017·1 cites·22 claims
- 3161US9373165B2Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performanceKLA TENCOR CORP·Filed 2014·Granted Jun 21, 2016·1 cites·26 claims
- 3261US6594002B2Wafer shape accuracy using symmetric and asymmetric instrument error signaturesADE CORP·Filed 2001·Granted Jul 15, 2003·8 cites·14 claims
- 3356US9588441B2Method and device for using substrate geometry to determine optimum substrate analysis samplingMACNAUGHTON CRAIG W·Filed 2012·Granted Mar 7, 2017·1 cites·38 claims
- 3455US6954269B2Ring chuck to hold 200 and 300 mm waferADE CORP·Filed 2003·Granted Oct 11, 2005·4 cites·27 claims
- 3554US9646379B1Detection of selected defects in relatively noisy inspection dataKLA TENCOR CORP·Filed 2016·Granted May 9, 2017·0 cites·33 claims
- 3654US7136519B2Specimen topography reconstructionADE CORP·Filed 2000·Granted Nov 14, 2006·4 cites·35 claims
- 3752US10036964B2Prediction based chucking and lithography control optimizationKLA TENCOR CORP·Filed 2015·Granted Jul 31, 2018·0 cites·32 claims
- 3850US10576603B2Patterned wafer geometry measurements for semiconductor process controlsKLA TENCOR CORP·Filed 2014·Granted Mar 3, 2020·0 cites·27 claims
- 3947US9052190B2Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sectionsKLA TENCOR CORP·Filed 2013·Granted Jun 9, 2015·0 cites·26 claims
- 4044US2011112796A1Curvature-Based Edge Bump QuantificationKLA TENCOR CORP·Filed 2010·Application pending·0 cites
- 4141US8594975B2Systems and methods for wafer edge feature detection and quantificationCHEN HAIGUANG·Filed 2011·Granted Nov 26, 2013·0 cites·14 claims
- 4241US2006005413A1Work piece positioning apparatusSINHA JAYDEEP K·Filed 2004·Application pending·0 cites
- 4334US7175214B2Wafer gripping fingers to minimize distortionADE CORP·Filed 2004·Granted Feb 13, 2007·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →