Inventor · disambiguated record
Mizuhisa Nihei
Also filed as: NIHEI MIZUHISA
18 granted patents·8 pending applications·154 citations·filing 2000–2022
93Inventor score
Top patents by PatentIndex Score
26 records- 0191US7867814B2Resistance memory element and method of manufacturing the sameFUJITSU LTD·Filed 2008·Granted Jan 11, 2011·16 cites·10 claims
- 0290US8163647B2Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereofKAWABATA AKIO·Filed 2009·Granted Apr 24, 2012·16 cites·9 claims
- 0388US7094692B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Aug 22, 2006·38 cites·17 claims
- 0483US7417320B2Substrate structure and manufacturing method of the sameFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·9 cites·13 claims
- 0583US7368823B1Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2006·Granted May 6, 2008·8 cites·4 claims
- 0682US6903365B1Electronic device using carbon element linear structure and production method thereofFUJITSU LTD·Filed 2003·Granted Jun 7, 2005·34 cites·7 claims
- 0780US7883968B2Field effect transistor and its manufacturing methodFUJITSU LTD·Filed 2010·Granted Feb 8, 2011·5 cites·3 claims
- 0877US7692238B2Field effect transistor and its manufacturing methodFUJITSU LTD·Filed 2005·Granted Apr 6, 2010·6 cites·19 claims
- 0969US8372487B2Carbon nanotube device and manufacturing method of the sameFUJITSU LTD·Filed 2009·Granted Feb 12, 2013·3 cites·8 claims
- 1068US7960277B2Electronic device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jun 14, 2011·4 cites·9 claims
- 1167US8029760B2Method of manufacturing carbon nanotubeFUJITSU LTD·Filed 2008·Granted Oct 4, 2011·1 cites·13 claims
- 1262US6822307B2Semiconductor triode device having a compound-semiconductor channel layerFUJITSU LTD·Filed 2000·Granted Nov 23, 2004·10 cites·11 claims
- 1355US8533945B2Wiring structure and method of forming the sameNIHEI MIZUHISA·Filed 2008·Granted Sep 17, 2013·2 cites·8 claims
- 1451US2022283349A1Wavelength selective filter and method for fabricating wavelength selective filterHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1545US6455361B1Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2000·Granted Sep 24, 2002·2 cites·7 claims
- 1645US2006212974A1Carbon nanotube device and manufacturing method of the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1744US2011073833A1Resistance memory element and method of manufacturing the sameFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1842US9576907B2Wiring structure and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Feb 21, 2017·0 cites·19 claims
- 1942US7948081B2Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 24, 2011·0 cites·18 claims
- 2042US2004182600A1Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2140US2006071344A1Wiring connection structure and method for forming the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2238US7786487B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Granted Aug 31, 2010·0 cites·8 claims
- 2337US2002195618A1Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2002·Application pending·0 cites
- 2436US9991187B2Electronic device and method for manufacturing the same, and substrate structure and method for manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jun 5, 2018·0 cites·10 claims
- 2533US2015351285A1Heat dissipation structure and synthesizing method thereofHUAWEI TECH CO LTD·Filed 2015·Application pending·0 cites
- 2633US2018179429A1Thermal Interface Material, Method For Preparing Thermal Interface Material, Thermally Conductive Pad, And Heat Dissipation SystemHUAWEI TECH CO LTD·Filed 2018·Application pending·0 cites
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