Inventor · disambiguated record
Je-Gwang Yoo
Also filed as: YOO JE G · YOO JE GWANG
37 granted patents·40 pending applications·241 citations·filing 1999–2015
97Inventor score
Top patents by PatentIndex Score
77 records- 0193US7886433B2Method of manufacturing a component-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·29 cites·7 claims
- 0292US8159824B2Printed circuit boardCHO HAN-SEO·Filed 2008·Granted Apr 17, 2012·51 cites·4 claims
- 0390US7707715B2Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 4, 2010·18 cites·21 claims
- 0490US7529439B2Optical printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted May 5, 2009·22 cites·7 claims
- 0588US7947906B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 24, 2011·19 cites·15 claims
- 0684US7489839B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 10, 2009·9 cites·7 claims
- 0782US8942004B2Printed circuit board having electronic components embedded thereinHONG SUK CHANG·Filed 2010·Granted Jan 27, 2015·13 cites·10 claims
- 0882US7992291B2Method of manufacturing a circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 9, 2011·9 cites·8 claims
- 0982US7991250B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Aug 2, 2011·5 cites·11 claims
- 1081US8279616B2Printed circuit board with embedded chip capacitorKIM HAN·Filed 2011·Granted Oct 2, 2012·4 cites·9 claims
- 1178US7809220B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 5, 2010·7 cites·10 claims
- 1274US8065797B2Fabricating method for printed circuit boardWATANABE RYOICHI·Filed 2007·Granted Nov 29, 2011·8 cites·10 claims
- 1373US8158889B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted Apr 17, 2012·4 cites·22 claims
- 1472US7672547B2Printed circuit board including optical waveguide and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 2, 2010·5 cites·16 claims
- 1571US7937833B2Method of manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 10, 2011·4 cites·8 claims
- 1670US8198550B2Printed circuit board and method of manufacturing the sameMOK JEE SOO·Filed 2009·Granted Jun 12, 2012·3 cites·6 claims
- 1769US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 1868US8966746B2Method of fabricating cavity capacitor embedded in printed circuit boardKIM HAN·Filed 2011·Granted Mar 3, 2015·2 cites·5 claims
- 1968US8457450B2Printed circuit board and manufacturing method thereofKIM SANG-HOON·Filed 2008·Granted Jun 4, 2013·2 cites·14 claims
- 2068US8056220B2Printed circuit board and manufacturing method thereofKIM SANG-HOON·Filed 2008·Granted Nov 15, 2011·3 cites·6 claims
- 2168US7903410B2Package board and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 8, 2011·4 cites·7 claims
- 2266US8181339B2Method of manufacturing a printed circuit boardKIM JOON-SUNG·Filed 2008·Granted May 22, 2012·2 cites·12 claims
- 2365US7983055B2Printed circuit board with embedded cavity capacitorSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 19, 2011·2 cites·15 claims
- 2462US8232478B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 31, 2012·1 cites·21 claims
- 2562US8022311B2Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 20, 2011·2 cites·11 claims
- 2662US2009130390A1Optical wiring board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2761US8169790B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted May 1, 2012·1 cites·21 claims
- 2861US8064217B2Component embedded printed circuit boardCHO SUK-HYEON·Filed 2007·Granted Nov 22, 2011·2 cites·5 claims
- 2960US7697800B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Apr 13, 2010·1 cites·3 claims
- 3059US8048324B2Method of manufacturing optical waveguide and method of manufacturing package boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 1, 2011·1 cites·11 claims
- 3156US2010024212A1Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3255US8592135B2Method of manufacturing printed circuit boardMOK JEE SOO·Filed 2012·Granted Nov 26, 2013·0 cites·7 claims
- 3354US2010230146A1Circuit layer comprising cnts and method of manufacturing the sameLEE EUNG SUEK·Filed 2009·Application pending·0 cites
- 3454US2012222299A1Method of manufacturing a printed circuit boardMOK JEE SOO·Filed 2012·Application pending·0 cites
- 3554US2009301767A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3654US2009085691A1Printed circuit board with embedded chip capacitor and chip capacitor embedment methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3754US2009294164A1Printed circuit board including landless via and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3854US2012199388A1Printed circuit board and manufacturing method thereofKIM JOON-SUNG·Filed 2012·Application pending·0 cites
- 3953US8151446B2Apparatus for manufacturing printed circuit boardMOK JEE-SOO·Filed 2008·Granted Apr 10, 2012·0 cites·2 claims
- 4053US2012066902A1Method of manufacturing printed circuit board including landless viaKIM HAN·Filed 2011·Application pending·0 cites
- 4152US7546002B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 9, 2009·0 cites·3 claims
- 4251US2009236131A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4351US2015195905A1Package board, method of manufacturing the same, and semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4450US8683684B2Method of manufacturing component embedded printed circuit boardCHO SUK-HYEON·Filed 2011·Granted Apr 1, 2014·0 cites·7 claims
- 4550US2009133444A1Method of manufacturing optical boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4650US2008264684A1Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4750US2009294956A1Cooling fin and package substrate comprising the cooling fin and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4850US2009236130A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4950US2009250259A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 5049US2008006942A1Bottom substrate of package on package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
Showing the top 50 of 77 patent records by PatentIndex Score.
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