Inventor · disambiguated record
Leena Paivikki Buchwalter
Also filed as: BUCHWALTER LEENA P · BUCHWALTER LEENA PAIVIKKI
21 granted patents·7 pending applications·854 citations·filing 1990–2012
96Inventor score
Top patents by PatentIndex Score
28 records- 0198US6184121B1Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the sameIBM·Filed 1998·Granted Feb 6, 2001·369 cites·39 claims
- 0297US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0393US6577011B1Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the sameIBM·Filed 2000·Granted Jun 10, 2003·86 cites·16 claims
- 0488US6255217B1Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 1999·Granted Jul 3, 2001·78 cites·18 claims
- 0587US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 0684US8269291B2Low temperature Bi-CMOS compatible process for MEMS RF resonators and filtersBUCHWALTER LEENA PAIVIKKI·Filed 2011·Granted Sep 18, 2012·6 cites·31 claims
- 0783US5133840ASurface midification of a polyimideIBM·Filed 1990·Granted Jul 28, 1992·40 cites·33 claims
- 0882US7943412B2Low temperature Bi-CMOS compatible process for MEMS RF resonators and filtersIBM·Filed 2002·Granted May 17, 2011·24 cites·9 claims
- 0981US7456046B2Method to create flexible connections for integrated circuitsIBM·Filed 2005·Granted Nov 25, 2008·8 cites·1 claims
- 1077US7019402B2Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductorIBM·Filed 2003·Granted Mar 28, 2006·23 cites·30 claims
- 1175US6261951B1Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 1999·Granted Jul 17, 2001·34 cites·19 claims
- 1274US7282391B1Method for precision assembly of integrated circuit chip packagesIBM·Filed 2006·Granted Oct 16, 2007·5 cites·22 claims
- 1372US6593660B2Plasma treatment to enhance inorganic dielectric adhesion to copperIBM·Filed 2001·Granted Jul 15, 2003·11 cites·12 claims
- 1465US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 1563US7815968B2Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formationIBM·Filed 2008·Granted Oct 19, 2010·2 cites·46 claims
- 1662US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 1761US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 1859US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 1953US2008217778A1Method to create flexible connections for integrated circuitsIBM·Filed 2008·Application pending·0 cites
- 2052US2008029889A1Method to create flexible connections for integrated circuitsIBM·Filed 2007·Application pending·0 cites
- 2151US7615405B2Method for precision assembly of integrated circuit chip packagesIBM·Filed 2007·Granted Nov 10, 2009·0 cites·15 claims
- 2246US2006027934A1Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2005·Application pending·0 cites
- 2345US2012270351A1Low temperature bi-cmos compatible process for mems rf resonators and filtersBUCHWALTER LEENA PAIVIKKI·Filed 2012·Application pending·0 cites
- 2441US2012091585A1Laser release process for very thin si-carrier buildBUCHWALTER LEENA P·Filed 2011·Application pending·0 cites
- 2539US8187923B2Laser release process for very thin Si-carrier buildANDRY PAUL STEPHEN·Filed 2008·Granted May 29, 2012·0 cites·10 claims
- 2638US2005168947A1Chip packaging module with active cooling mechanismsFiled 2003·Application pending·0 cites
- 2736US6818843B2Microswitch with a micro-electromechanical systemERICSSON TELEFON AB L M·Filed 2003·Granted Nov 16, 2004·0 cites·8 claims
- 2836US2008036084A1Laser release process for very thin Si-carrier buildIBM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →