Low temperature bi-cmos compatible process for mems rf resonators and filters

Abstract

A method of removal of a first and second sacrificial layer wherein an O 2 plasma or an O 2 -containing environment is introduced to a cavity and a gap region through a plurality of via holes in a cavity capping material.

1 . A method of removal of a first and second sacrificial layer wherein the sacrificial material is exposed to an oxygen plasma. 
     
     
         2 . A method of removal of a first and second sacrificial layer wherein the sacrificial material is exposed to an anneal in an oxygen containing environment. 
     
     
         3 . The method of removal of a first and second sacrificial layer of  claim 2 , wherein the first and second sacrificial layers are exposed to the anneal in the oxygen containing environment at a temperature less than 400 degrees C. 
     
     
         4 . A method of removal of a first and second sacrificial layer wherein an O 2  plasma or an O 2 -containing environment is introduced to a cavity and a gap region through a plurality of via holes in a cavity capping material. 
     
     
         5 . The method of  claim 4 , wherein the first and second sacrificial layers are a carbon-based material. 
     
     
         6 . The method of  claim 4 , wherein the removal of the first and second sacrificial layers is performed without a subsequent rinsing of the cavity. 
     
     
         7 . The method of  claim 4 , further comprising capping the cavity with a second material having a resistance to etching greater than that of the first and second sacrificial layers. 
     
     
         8 . The method of  claim 4 , further comprising forming one of a microelectromechanical resonator and a microelectromechanical filter in the cavity before the removal of the first and second sacrificial layers. 
     
     
         9 . The method of  claim 4 , further comprising sealing the plurality of holes, wherein the plurality of holes have an aspect ratio to substantially prevent a sealing material from entering the cavity.