Inventor · disambiguated record
Ye-Chung Chung
Also filed as: CHUNG YE CHUNG
21 granted patents·8 pending applications·145 citations·filing 2003–2023
94Inventor score
Top patents by PatentIndex Score
29 records- 0191US7459779B2Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB packageSAMSUNG ELECTRIC·Filed 2005·Granted Dec 2, 2008·14 cites·15 claims
- 0289US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0388US7732933B2Semiconductor chip and TAB package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 8, 2010·15 cites·20 claims
- 0488US7683471B2Display driver integrated circuit device, film, and moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·9 cites·13 claims
- 0587US7329597B2Semiconductor chip and tab package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·14 cites·28 claims
- 0682US10699974B2Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 0782US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0878US7652366B2Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 26, 2010·4 cites·7 claims
- 0978US7217990B2Tape package having test pad on reverse surface and method for testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 15, 2007·23 cites·1 claims
- 1078US7109575B2Low-cost flexible film package module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 19, 2006·15 cites·9 claims
- 1172US7902647B2TAB package connecting host device elementSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 8, 2011·4 cites·12 claims
- 1267US10607939B2Semiconductor packages and display devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·1 cites·20 claims
- 1367US7649246B2Tab package connecting host device elementSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 19, 2010·3 cites·19 claims
- 1465US7087987B2Tape circuit substrate and semiconductor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 8, 2006·11 cites·26 claims
- 1563US9557616B2Source driver, an image display assembly and an image display apparatusCHUNG YE-CHUNG·Filed 2011·Granted Jan 31, 2017·2 cites·15 claims
- 1660US10903127B2Film for a package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 26, 2021·0 cites·20 claims
- 1760US2024258489A1Display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1859US6919513B2Film carrier tape for semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 19, 2005·8 cites·18 claims
- 1957US9129972B2Semiconductor packageCHO YOUNG-SANG·Filed 2009·Granted Sep 8, 2015·1 cites·20 claims
- 2056US11133262B2Semiconductor packages and display devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·16 claims
- 2152US7999341B2Display driver integrated circuit device, film, and moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Aug 16, 2011·0 cites·3 claims
- 2251US2006268213A1Low-cost flexible film package module and method of manufacturing the sameKANG SA-YOON·Filed 2006·Application pending·0 cites
- 2349US10163942B2Source driver, an image display assembly and an image display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 2449US2009065934A1Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2546US2007042166A1Tape substrate having reinforcement layer for tape packagesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2643US2008063789A1Tape substrate having reinforcement layer for tape packagesCHUNG YE-CHUNG·Filed 2007·Application pending·0 cites
- 2739US2012138968A1Semiconductor package and display panel assembly having the sameSHIN NA-RAE·Filed 2011·Application pending·0 cites
- 2837US2012021600A1Method of fabricating film circuit substrate and method of fabricating chip package including the sameHAN SANG-UK·Filed 2011·Application pending·0 cites
- 2934US2018049324A1Semiconductor packages and display devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →