Inventor · disambiguated record
Masaaki Sakuta
Also filed as: SAKUTA MASAAKI
19 granted patents·7 pending applications·169 citations·filing 2001–2013
94Inventor score
Top patents by PatentIndex Score
26 records- 0194US8409366B2Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereofOGIHARA MITSUHIKO·Filed 2010·Granted Apr 2, 2013·20 cites·14 claims
- 0291US6913985B2Method of manufacturing a semiconductor deviceOKI DATA KK·Filed 2004·Granted Jul 5, 2005·58 cites·35 claims
- 0387US7239337B2Combined semiconductor apparatus with thin semiconductor filmsOKI DATA KK·Filed 2003·Granted Jul 3, 2007·23 cites·58 claims
- 0486US7180099B2Semiconductor apparatus with thin semiconductor filmOKI DATA KK·Filed 2003·Granted Feb 20, 2007·27 cites·1 claims
- 0583US7871834B2Combined semiconductor apparatus with thin semiconductor filmsOKI DATA KK·Filed 2009·Granted Jan 18, 2011·5 cites·1 claims
- 0673US8343848B2Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor deviceOKI DATA KK·Filed 2008·Granted Jan 1, 2013·3 cites·8 claims
- 0768US7408566B2Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor deviceOKI DATA KK·Filed 2004·Granted Aug 5, 2008·9 cites·14 claims
- 0867US8664668B2Combined semiconductor apparatus with semiconductor thin filmOGIHARA MITSUHIKO·Filed 2009·Granted Mar 4, 2014·3 cites·1 claims
- 0966US8395184B2Semiconductor device based on the cubic silicon carbide single crystal thin filmOGIHARA MITSUHIKO·Filed 2012·Granted Mar 12, 2013·1 cites·4 claims
- 1063US8524366B2Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene deviceOGIHARA MITSUHIKO·Filed 2010·Granted Sep 3, 2013·1 cites·11 claims
- 1162US7122834B2Semiconductor apparatus having adhesion layer and semiconductor thin filmOKI DATA KK·Filed 2003·Granted Oct 17, 2006·10 cites·18 claims
- 1256US8816384B2Semiconductor apparatus with thin semiconductor filmOKI DATA KK·Filed 2013·Granted Aug 26, 2014·0 cites·34 claims
- 1356US8395159B2Semiconductor apparatus with thin semiconductor filmOGIHARA MITSUHIKO·Filed 2009·Granted Mar 12, 2013·0 cites·6 claims
- 1455US7456449B2Semiconductor apparatus, LED print head, and printerOKI DATA KK·Filed 2004·Granted Nov 25, 2008·7 cites·15 claims
- 1554US2004015390A1Working process administering system and methodFiled 2001·Application pending·0 cites
- 1652US8445935B2Semiconductor apparatus with thin semiconductor filmOGIHARA MITSUHIKO·Filed 2011·Granted May 21, 2013·0 cites·19 claims
- 1752US2007120140A1Semiconductor apparatus with thin semiconductor filmOGIHARA MITSUHIKO·Filed 2007·Application pending·0 cites
- 1852US2007114556A1Semiconductor apparatus with thin semiconductor filmOGIHARA MITSUHIKO·Filed 2007·Application pending·0 cites
- 1951US8748918B2Semiconductor device and optical print headOGIHARA MITSUHIKO·Filed 2009·Granted Jun 10, 2014·0 cites·18 claims
- 2049US9093562B2Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED headOGIHARA MITSUHIKO·Filed 2010·Granted Jul 28, 2015·0 cites·11 claims
- 2149US8216366B2Method for manufacturing a cubic silicon carbide single crystal thin film and semiconductor device based on the cubic silicon carbide single crystal thin filmOGIHARA MITSUHIKO·Filed 2010·Granted Jul 10, 2012·0 cites·8 claims
- 2249US2007235883A1Combined semiconductor apparatus and a fabricating method thereofOGIHARA MITSUHIKO·Filed 2007·Application pending·0 cites
- 2346US7880190B2Combined semiconductor device, LED print head, and image forming apparatusOKI DATA KK·Filed 2004·Granted Feb 1, 2011·2 cites·18 claims
- 2446US2008251798A1Semiconductor device, LED head and image forming apparatusOKI DATA KK·Filed 2008·Application pending·0 cites
- 2546US2006097354A1Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED headOGIHARA MITSUHIKO·Filed 2005·Application pending·0 cites
- 2640US2004135157A1Combined semiconductor apparatus with semiconductor thin filmFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →