Inventor · disambiguated record
Siew Neo
Also filed as: NEO SIEW · NEO SIEW S
27 granted patents·6 pending applications·650 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
33 records- 0198US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0297US10573522B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2017·Granted Feb 25, 2020·38 cites·20 claims
- 0396US11355345B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2019·Granted Jun 7, 2022·21 cites·14 claims
- 0496US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0596US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0696US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0795US12362188B2Method for preventing line bending during metal fill processLAM RES CORP·Filed 2022·Granted Jul 15, 2025·2 cites·14 claims
- 0895US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 0992US6863797B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·45 cites·41 claims
- 1091US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 1188US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 1286US7229535B2Hydrogen bubble reduction on the cathode using double-cell designsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 12, 2007·25 cites·20 claims
- 1386US6837983B2Endpoint detection for electro chemical mechanical polishing and electropolishing processesAPPLIED MATERIALS INC·Filed 2002·Granted Jan 4, 2005·32 cites·39 claims
- 1486US2025323045A1Method for preventing line bending during metal fill processLAM RES CORP·Filed 2025·Application pending·0 cites
- 1584US7790015B2Endpoint for electroprocessingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·15 claims
- 1683US8066552B2Multi-layer polishing pad for low-pressure polishingDUBOUST ALAIN·Filed 2005·Granted Nov 29, 2011·10 cites·31 claims
- 1781US10214807B2Atomic layer deposition of tungsten for enhanced fill and reduced substrate attackLAM RES CORP·Filed 2016·Granted Feb 26, 2019·3 cites·14 claims
- 1881US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 1978US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 2076US7628905B2Algorithm for real-time process control of electro-polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 8, 2009·2 cites·3 claims
- 2174US10337087B2Off-axis epitaxial lift off processALTA DEVICES INC·Filed 2018·Granted Jul 2, 2019·0 cites·13 claims
- 2273US7232514B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jun 19, 2007·15 cites·63 claims
- 2373US2018209018A1Off-axis epitaxial lift processALTA DEVICES INC·Filed 2018·Application pending·0 cites
- 2472US6991526B2Control of removal profile in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2002·Granted Jan 31, 2006·14 cites·14 claims
- 2571US7384534B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·2 cites·16 claims
- 2665US9994936B2Off-axis epitaxial lift off processGMITTER THOMAS·Filed 2011·Granted Jun 12, 2018·0 cites·10 claims
- 2755US11225712B2Atomic layer deposition of tungsten for enhanced fill and reduced substrate attackLAM RES CORP·Filed 2019·Granted Jan 18, 2022·0 cites·5 claims
- 2850US7112270B2Algorithm for real-time process control of electro-polishingAPPLIED MATERIALS INC·Filed 2003·Granted Sep 26, 2006·3 cites·14 claims
- 2949US2010267318A1Polishing pad with projecting portionDUBOUST ALAIN·Filed 2010·Application pending·0 cites
- 3048US2007295611A1Method and composition for polishing a substrateLIU FENG Q·Filed 2007·Application pending·0 cites
- 3145US2004072445A1Effective method to improve surface finish in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3244US2005061674A1Endpoint compensation in electroprocessingFiled 2004·Application pending·0 cites
- 3343US7678245B2Method and apparatus for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Mar 16, 2010·0 cites·26 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →