Inventor · disambiguated record
Michael J. Ries
Also filed as: RIES MICHAEL J · RIES MICHAEL JOHN
9 granted patents·6 pending applications·223 citations·filing 1997–2015
89Inventor score
Files withMEMC ELECTRONIC MATERIALS10MEMC ELECTRIC MATERIALS INC1RIES MICHAEL J1RIES MICHAEL JOHN1SUNEDISON INC1
Top patents by PatentIndex Score
15 records- 0192US8859393B2Methods for in-situ passivation of silicon-on-insulator wafersRIES MICHAEL J·Filed 2011·Granted Oct 14, 2014·64 cites·5 claims
- 0289US6596095B2Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereofMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 22, 2003·42 cites·35 claims
- 0386US8845859B2Systems and methods for cleaving a bonded wafer pairRIES MICHAEL JOHN·Filed 2012·Granted Sep 30, 2014·11 cites·21 claims
- 0483US6497403B2Semiconductor wafer holderMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Dec 24, 2002·31 cites·26 claims
- 0577US6339016B1Method and apparatus for forming an epitaxial silicon wafer with a denuded zoneMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jan 15, 2002·28 cites·18 claims
- 0667US5792273ASecondary edge reflector for horizontal reactorMEMC ELECTRIC MATERIALS INC·Filed 1997·Granted Aug 11, 1998·32 cites·14 claims
- 0766US9281233B2Method for low temperature layer transfer in the preparation of multilayer semiconductor devicesSUNEDISON INC·Filed 2013·Granted Mar 8, 2016·2 cites·13 claims
- 0849US2010130021A1Method for processing a silicon-on-insulator structureMEMC ELECTRONIC MATERIALS·Filed 2009·Application pending·0 cites
- 0945US6086678APressure equalization system for chemical vapor deposition reactorsMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Jul 11, 2000·13 cites·22 claims
- 1044US2006075960A1Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitatesMEMC ELECTRONIC MATERIALS·Filed 2005·Application pending·0 cites
- 1142US10068795B2Methods for preparing layered semiconductor structuresSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2015·Granted Sep 4, 2018·0 cites·24 claims
- 1236US2002127766A1Semiconductor wafer manufacturing processMEMC ELECTRONIC MATERIALS·Filed 2001·Application pending·0 cites
- 1336US2002179006A1Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitatesMEMC ELECTRONIC MATERIALS·Filed 2002·Application pending·0 cites
- 1436US2005032337A1Method and apparatus for forming a silicon wafer with a denuded zoneMEMC ELECTRONIC MATERIALS·Filed 2004·Application pending·0 cites
- 1534US2002078882A1Apparatus for forming an epitaxial silicon wafer with a denuded zoneMEMC ELECTRONIC MATERIALS·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →