Inventor · disambiguated record
Chang Beom Yong
Also filed as: YONG CHANG · YONG CHANG BEOM
9 granted patents·87 citations·filing 2000–2022
85Inventor score
Top patents by PatentIndex Score
9 records- 0188US9195898B2Systems and methods for image recognition using mobile devicesHUANG JOSEPH JYH-HUEI·Filed 2009·Granted Nov 24, 2015·38 cites·57 claims
- 0283US6834190B1Controlling method and apparatus for transition between modes at traffic channel substrate in mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Dec 21, 2004·40 cites·14 claims
- 0381US11506598B2Compact apparatus for high-speed chemical spectral signature measurement and method of using sameGAO WEI·Filed 2019·Granted Nov 22, 2022·2 cites·19 claims
- 0474US8558389B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferNA DUK JU·Filed 2011·Granted Oct 15, 2013·5 cites·20 claims
- 0573US12007323B2Compact apparatus for high-speed chemical spectral signature measurement and method of using sameEPIR INC·Filed 2022·Granted Jun 11, 2024·0 cites·19 claims
- 0660US9076655B2Semiconductor device and method of forming through-silicon-via with sacrificial layerSTATS CHIPPAC LTD·Filed 2013·Granted Jul 7, 2015·2 cites·22 claims
- 0754US9601462B2Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor waferSTATS CHIPPAC LTD·Filed 2014·Granted Mar 21, 2017·0 cites·22 claims
- 0851US9257382B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferSTATS CHIPPAC LTD·Filed 2013·Granted Feb 9, 2016·0 cites·25 claims
- 0944US9865524B2Semiconductor device and method of forming conductive vias using backside via reveal and selective passivationSTATS CHIPPAC LTD·Filed 2014·Granted Jan 9, 2018·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →