Inventor · disambiguated record
Duk Ju Na
Also filed as: NA DUK JU
10 granted patents·34 citations·filing 2011–2017
85Inventor score
Top patents by PatentIndex Score
10 records- 0190US9184104B1Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulantSTATS CHIPPAC LTD·Filed 2014·Granted Nov 10, 2015·17 cites·31 claims
- 0283US10553487B2Semiconductor device and method of forming conductive vias by direct via reveal with organic passivationSTATS CHIPPAC PTE LTD·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0374US8558389B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferNA DUK JU·Filed 2011·Granted Oct 15, 2013·5 cites·20 claims
- 0472US10115701B2Semiconductor device and method of forming conductive vias by backside via reveal with CMPSTATS CHIPPAC LTD·Filed 2014·Granted Oct 30, 2018·4 cites·18 claims
- 0560US9076655B2Semiconductor device and method of forming through-silicon-via with sacrificial layerSTATS CHIPPAC LTD·Filed 2013·Granted Jul 7, 2015·2 cites·22 claims
- 0658US9728415B2Semiconductor device and method of wafer thinning involving edge trimming and CMPSTATS CHIPPAC LTD·Filed 2013·Granted Aug 8, 2017·1 cites·23 claims
- 0756US9281274B1Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereofZHAO XING·Filed 2013·Granted Mar 8, 2016·1 cites·17 claims
- 0851US9768066B2Semiconductor device and method of forming conductive vias by direct via reveal with organic passivationSTATS CHIPPAC LTD·Filed 2014·Granted Sep 19, 2017·0 cites·22 claims
- 0951US9257382B2Semiconductor device and method of forming guard ring around conductive TSV through semiconductor waferSTATS CHIPPAC LTD·Filed 2013·Granted Feb 9, 2016·0 cites·25 claims
- 1044US9865524B2Semiconductor device and method of forming conductive vias using backside via reveal and selective passivationSTATS CHIPPAC LTD·Filed 2014·Granted Jan 9, 2018·0 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when Duk Ju Na files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →