Inventor · disambiguated record
Paul Kasulke
Also filed as: KASULKE PAUL
15 granted patents·586 citations·filing 1996–2001
94Inventor score
Top patents by PatentIndex Score
15 records- 0197US6281577B1Chips arranged in plurality of planes and electrically connected to one anotherPAC TECH GMBH·Filed 1997·Granted Aug 28, 2001·350 cites·7 claims
- 0275US6651891B1Method for producing contactless chip cards and corresponding contactless chip cardZAKEL ELKE·Filed 1997·Granted Nov 25, 2003·56 cites·22 claims
- 0368US6277660B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Aug 21, 2001·12 cites·10 claims
- 0465US7121449B2Method and device for applying material to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Oct 17, 2006·13 cites·17 claims
- 0565US7087442B2Process for the formation of a spatial chip arrangement and spatial chip arrangementPAC TECH GMBH·Filed 2001·Granted Aug 8, 2006·11 cites·6 claims
- 0663US7829817B2Device for removing solder material from a soldered jointPAC TECH GMBH·Filed 2001·Granted Nov 9, 2010·11 cites·5 claims
- 0762US5989993AMethod for galvanic forming of bonding padsZAKEL ELKE·Filed 1996·Granted Nov 23, 1999·30 cites·14 claims
- 0860US6119919AMethod and device for repairing defective soldered jointsPAC TECH GMBH·Filed 1998·Granted Sep 19, 2000·26 cites·9 claims
- 0958US6955284B2Device for positioning a tool in relation to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Oct 18, 2005·7 cites·8 claims
- 1055US7021517B2Method and device for applying pieces of material to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Apr 4, 2006·8 cites·19 claims
- 1153US6043985AThermal connecting structure for connecting materials with different expansion coefficientsFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Mar 28, 2000·21 cites·7 claims
- 1252US6093971AChip module with conductor paths on the chip bonding side of a chip carrierFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Jul 25, 2000·18 cites·11 claims
- 1348US6211571B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Apr 3, 2001·12 cites·11 claims
- 1439US6056188AMethod of attaching a component to a plate-shaped supportPAC TECH GMBH·Filed 1998·Granted May 2, 2000·8 cites·12 claims
- 1532US6328200B1Process for selective solderingPAC TECH GMBH·Filed 1997·Granted Dec 11, 2001·3 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →