Assignee
PAC TECH GMBH
DE·20 granted patents·1 pending application·587 citations·filing 1997–2011
Top patents by PatentIndex Score
21 records- 0197US6281577B1Chips arranged in plurality of planes and electrically connected to one anotherPAC TECH GMBH·Filed 1997·Granted Aug 28, 2001·350 cites·7 claims
- 0285US7882997B2Method and device for mutual contacting of two wafersPAC TECH GMBH·Filed 2005·Granted Feb 8, 2011·13 cites·20 claims
- 0382US6713714B1Method and device for thermally connecting the contact surfaces of two substratesPAC TECH GMBH·Filed 2000·Granted Mar 30, 2004·27 cites·10 claims
- 0472US7717316B2Method and device for applying a solder to a substratePAC TECH GMBH·Filed 2007·Granted May 18, 2010·4 cites·10 claims
- 0572US6394158B1Method and device for thermally bonding connecting surfaces of two substratesPAC TECH GMBH·Filed 1998·Granted May 28, 2002·56 cites·10 claims
- 0671US8361881B2Method for alternately contacting two wafersPAC TECH GMBH·Filed 2011·Granted Jan 29, 2013·3 cites·6 claims
- 0765US7087442B2Process for the formation of a spatial chip arrangement and spatial chip arrangementPAC TECH GMBH·Filed 2001·Granted Aug 8, 2006·11 cites·6 claims
- 0863US7829817B2Device for removing solder material from a soldered jointPAC TECH GMBH·Filed 2001·Granted Nov 9, 2010·11 cites·5 claims
- 0960US6119919AMethod and device for repairing defective soldered jointsPAC TECH GMBH·Filed 1998·Granted Sep 19, 2000·26 cites·9 claims
- 1058US6915940B2Device for applying solder globulesPAC TECH GMBH·Filed 2002·Granted Jul 12, 2005·6 cites·5 claims
- 1157US7007834B2Contact bump construction for the production of a connector construction for substrate connecting surfacesPAC TECH GMBH·Filed 2001·Granted Mar 7, 2006·7 cites·7 claims
- 1256US6769599B1Method and device for placing and remelting shaped pieces consisting of solder materialPAC TECH GMBH·Filed 1999·Granted Aug 3, 2004·20 cites·21 claims
- 1355US6955943B2Method for producing a substrate arrangementPAC TECH GMBH·Filed 2002·Granted Oct 18, 2005·6 cites·16 claims
- 1448US6059176ADevice and a method for applying a plurality of solder globules to a substratePAC TECH GMBH·Filed 1998·Granted May 9, 2000·16 cites·10 claims
- 1546US6720257B1Bump with basic metallization and method for manufacturing the basic metallizationPAC TECH GMBH·Filed 2000·Granted Apr 13, 2004·2 cites·19 claims
- 1643US7481352B2Method for ablating points of contact (debumping)PAC TECH GMBH·Filed 2001·Granted Jan 27, 2009·2 cites·26 claims
- 1739US6335626B1Method and device for determining a parameter for a metallization bathPAC TECH GMBH·Filed 1998·Granted Jan 1, 2002·12 cites·16 claims
- 1839US6056188AMethod of attaching a component to a plate-shaped supportPAC TECH GMBH·Filed 1998·Granted May 2, 2000·8 cites·12 claims
- 1932US6328200B1Process for selective solderingPAC TECH GMBH·Filed 1997·Granted Dec 11, 2001·3 cites·14 claims
- 2027US2002040923A1Contact structure for connecting two substrates and also process for producing such a contact structurePAC TECH GMBH·Filed 2001·Application pending·0 cites
- 2123US6642727B1Chip carrier device and method for the production of a chip carrier device with an electrical testPAC TECH GMBH·Filed 1999·Granted Nov 4, 2003·4 cites·14 claims
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